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EVS International, the leader in solder recovery, is pleased to announce the appointment of ARK Manufacturing Solutions, LLC as its manufacturers’ representative. Dave Murrin, President and principal owner of ARK Mfg., will represent EVS’ solder recovery systems in Arizona, New Mexico, and Southern Nevada.
“We are really excited to partner with Dave,” stated Simon Norman, Business Director at EVS. “His knowledge of the industry and experience made this an easy choice.”
Formerly Phoenix Marketing Representatives, ARK Mfg. Solutions has been in business for more than 20 years, having had the good fortune to represent some of the best manufacturers in the electronics industry and serve the best customer base in the market.
EVS’ new Solder Recovery Systems are fully lead-free compatible. Lead-free solder is used around the world and many EVS customers are using the EVS Solder Recovery Systems on all types of lead-free alloys (SAC305, SN100 and SAC X ECT). In Europe, the European Union has eliminated the use of lead from the electronics industry completely.
The price of lead-free solder is three to four times that of present leaded solder so the savings and payback from using EVS technology has leaped forward, making solder recovery the fastest payback of all circuit board assembly capital purchases.
Zac Elliott, Siemens Digital Industries Software
Let’s face it, in the past, electronics manufacturing has not been a big business for North America. A majority of electronics are assembled in Asia where supply chains and operating costs offer many economic advantages. In North America, the electronics manufacturing industry has been generally focused on lower volume, high-cost devices, while higher volume products are produced elsewhere. However, the COVID pandemic and various legislation in the U.S. are changing the situation, making electronics manufacturing in North America a more attractive option. How can factories in North America compete for the same type of manufacturing traditionally performed in lower-cost regions?
Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. José Servin has worked as an IPC member for more than 14 years in the development of the Electronics Assembly Norms. As a member of the IPC A-610 and J STD-001 working groups, he became chairman of IPC A-610G and J STD-001G Automotive Addendums that complements the norms for automotive industry since 2018.
Patty Goldman, I-Connect007
Doug Pauls holds a B.A. in chemistry and physics from Carthage College, Kenosha, Wisconsin, and a B.S. in electrical engineering from the University of Wisconsin, Madison. He worked nine years for the Navy, eight years as technical director of Contamination Studies Labs, and 19 years at Rockwell Collins (now Collins Aerospace), in the Advanced Operations Engineering group, where he is a principal materials and process engineer. Doug was awarded the Rockwell Collins Arthur A. Collins Engineer of the Year Award in 2004.