Indium Corporation Expert Dr. HongWen Zhang to Present at ICEP


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Indium Corporation’s Alloy Group R&D Manager Dr. HongWen Zhang will present on a high-temperature lead-free solder paste at the International Conference on Electronics Packaging (ICEP), supported by the International Microelectronics Assembly and Packaging Society (IMAPS), May 11-14 in Hokkaido, Japan. 

The harmful effects of lead on human health and the environment are driving the development of high-temperature lead-free (HTLF) solders to replace high-lead solders for die-attachment and clip-bond in power device applications. In his presentation, A Drop-In High-Temperature Pb-Free Solder Paste Outperforms High-Pb Pastes in Power Discrete Applications, Dr. Zhang examines a new formulation of Indium Corporation’s innovative material Durafuse™—a novel design based on a mixed-alloy technology—designed to deliver an Sn-rich HTLF paste, presenting the merits of both constituent alloys. This product, Durafuse™ HT, has shown the feasibility as a drop-in solution to replace high-Pb solders for die-attach in power discrete applications by delivering improved performance.

Dr. Zhang is manager of the alloy group in Indium Corporation’s R&D department. His focus is on the development of Pb-free solder materials and the associated technologies for high-temperature and high-reliability applications. He was instrumental in inventing the mixed-alloy solder technique to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding surface, and control the joint’s morphology, thus improving reliability.

Dr. Zhang has a bachelor’s degree in metallurgical physical chemistry from Central South University of China, a master’s degree in materials and engineering from the Institute of Metal Research, Chinese Academy of Science, and a master’s degree in mechanical engineering and a Ph.D. in material science and engineering from the Michigan Technological University. He has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is a certified IPC Specialist for IPC-A-600 and IPC-A-610 as well as a certified SMT Process Engineer. He has extensive experience in various aluminum (Al) alloys and fiber/particle reinforced Al-based composite materials, and Al-rich and ZrHf-based amorphous alloys. He has co-authored two book chapters on high-temperature lead-free bonding materials, has had a number of patents filed, and has been published in approximately 20 journals in the fields of metallurgy, materials science and engineering, physics, electronics materials, and mechanics.

Download The Printed Circuit Assembler’s Guide to… Solder Defectsby Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007e Book library here. 

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