Hentec/RPS to Exhibit Selective Soldering Systems at SMTA Huntsville Expo & Tech Forum

Reading time ( words)

Hentec Industries/RPS Automation announces that it will exhibit its full line of selective soldering, component lead tinning and solderability test equipment at the upcoming SMTA Huntsville Expo & Tech Forum to be held at the Jackson Center, in Huntsville, Alabama on April 12, 2022.

At the SMTA event, Tom Baro, National Sales Manager for Hentec/RPS will be on-site to discuss how Hentec/RPS selective soldering, component lead tinning and solderability test equipment can improve the production quality of your printed circuit board assembly operation.  The Vector and Valence selective soldering systems feature unlimited program storage, integrated system software, witness camera and auto fiducial correction.  Available in either standalone or SMEMA in-line configurations, the Vector and Valence are offered with topside preheat, spray or drop-jet fluxer, dual flux nozzles, and custom or wave solder nozzles.  All Vector and Valence systems are UL and CE certified and carry both a two-year system warranty and a four-year solder pot warranty. 

Hentec/RPS Odyssey robotic hot solder dip machines are MIL spec complaint component lead tinning machines designed for gold removal, re-tinning applications, including high reliability and military applications as well as BGA de-balling.  The Pulsar solderability test system features a dip-and-look qualitative test method to verify the solderability of the surface of electronic components and can be easily performed by shop floor personnel with minimal training.


Suggested Items

VJ Electronix: Automating the X-ray Inspection Process

05/04/2022 | Nolan Johnson, I-Connect007
VJ Electronix's Brennan Caissie shares the benefits of a new inspection tool that can be used on a variety of boards, with an automated system that takes the pressure off the manufacturing floor operators and can provide feedback all the way to the design process.

Dave Hillman on Living Your Passion

03/29/2022 | Barry Matties, I-Connect007
Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.

IPC’s Dieter Bergman Fellowship Award Presented to Bev Christian, HDPUG

03/14/2022 | Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Bev Christian is a facilitator for the High Density Packaging User Group (HDPUG) and an adjunct associate professor in the Department of Mechanical and Mechatronics Engineering of the University of Waterloo, Waterloo, Ontario, Canada. In the past 31 years he has held positions at Nortel, BlackBerry, and CALCE; all in the areas of materials and failure analysis. Bev has never missed an IPC APEX EXPO since its inception. He is a member of 27 IPC committees and attends as time and the lack of clones allow.

Copyright © 2022 I-Connect007. All rights reserved.