EVS International Signs on Competitive Edge Solutions in New England


Reading time ( words)

EVS International, the leader in solder recovery, is pleased to announce that it has signed on Competitive Edge Solutions, LLC as its newest manufacturers’ representative. Dave Wilson, President, will represent EVS throughout the six New England states (MA, CT, RI, VT, NH, ME).

Understanding process/product needs and selecting the right equipment is critical to the success of your business. Competitive Edge Solutions has the resources to help your company gain an advantage, enhance a process, or develop a solution to a problem.

Competitive Edge Solutions has more than 25 years of practical experience in providing industry-leading equipment to exceed its customers’ needs. Dave Wilson, President of Competitive Edge Solutions, remarks “EVS International’s industry-leading solder recovery systems provide a unique solution to the high cost of materials, specifically Pb Free alloys, in a time of need. As the cost of alloys go up, every manufacturer can actively reduce their operating costs by utilizing this simple, easy to operate system. Let us show you how it works and the fast ROI it will produce.”

EVS’ new Solder Recovery Systems are fully lead-free compatible. Lead-free solder is used around the world and many EVS customers are using the EVS Solder Recovery Systems on all types of lead-free alloys (SAC305, SN100C and SAC X ECT).

The price of lead-free solder is three to four times that of present leaded solder so that the savings and payback from using EVS technology has leapt forward, making solder recovery the fastest payback of all circuit board assembly capital purchases.

Share




Suggested Items

VJ Electronix: Automating the X-ray Inspection Process

05/04/2022 | Nolan Johnson, I-Connect007
VJ Electronix's Brennan Caissie shares the benefits of a new inspection tool that can be used on a variety of boards, with an automated system that takes the pressure off the manufacturing floor operators and can provide feedback all the way to the design process.

Dave Hillman on Living Your Passion

03/29/2022 | Barry Matties, I-Connect007
Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.

IPC’s Dieter Bergman Fellowship Award Presented to Bev Christian, HDPUG

03/14/2022 | Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Bev Christian is a facilitator for the High Density Packaging User Group (HDPUG) and an adjunct associate professor in the Department of Mechanical and Mechatronics Engineering of the University of Waterloo, Waterloo, Ontario, Canada. In the past 31 years he has held positions at Nortel, BlackBerry, and CALCE; all in the areas of materials and failure analysis. Bev has never missed an IPC APEX EXPO since its inception. He is a member of 27 IPC committees and attends as time and the lack of clones allow.



Copyright © 2022 I-Connect007. All rights reserved.