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Indium Corporation Principal Engineer and Manager for Thermal Interface Materials Applications Andy Mackie, Ph.D., M.Sc., has taken on a new role on the iNEMI Board of Directors.
Dr. Mackie was voted in as the newest member of the board of directors for a three-year period, which began April 1. The board provides overall oversight and governance of iNEMI operations. This includes decisions regarding policy, strategy, and direction of the consortium. The board comprises eight to 13 voting directors who are executives from a cross-section of participating organizations.
“This is a wonderful and timely opportunity to influence the strategic direction of iNEMI, and builds off my past participation in the iNEMI automotive electronics reliability initiative and the PCB/PCBA Material Characterization for Harsh Environments,” said Dr. Mackie. “At Indium Corporation, we believe in collaborating with our fellow industry experts and thought leaders to develop materials solutions that enable future technologies—I am eager to help accelerate the industry through my new role with iNEMI.”
Dr. Mackie is an electronics industry expert with a technical background in physical chemistry, surface chemistry, rheology, semiconductor fabrication, and assembly materials and processes. His professional experience covers all aspects of electronics manufacturing from wafer fabrication to semiconductor packaging and SMT/electronics assembly. Dr. Mackie was also responsible for the development of Indium Corporation’s first Applied Technology Roadmap. In his current role, he is focused on identifying thermal material needs and trends for various high-performance applications, as well as the development and testing of innovative solutions to meet the emerging thermal interface material requirements. Dr. Mackie has been an invited international keynote speaker and has lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to solder paste rheology. He holds patents in novel polymers, heterogeneous catalysis, and solder paste formulation. He holds a Ph.D. in physical chemistry from the University of Nottingham, U.K; a master’s degree in colloid and interface science from the University of Bristol, U.K; and a bachelor’s degree in chemistry from the University of Leicester, U.K.
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