Indium Corporation Features High-Reliability Auto Products at SMTconnect

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Indium Corporation will feature selections from its portfolio of high-reliability automotive solutions at SMTconnect, May 10-12 in Nuremberg, Germany.

Indium Corporation has developed a suite of leading-edge materials and technology expertise to meet the increasingly rigorous demands of high-reliability applications – including the automotive and rapidly-evolving electric vehicle markets – such as its suite of Rel-ion™ technology solutions for e-Mobility. Indium Corporation continues to deliver proven high-reliability material solutions to current and emerging automotive challenges.

Indium Corporation’s LV2K is an ultra-flat, flux-coated solder preform that produces lower voiding and solder joints with better reliability as compared to conventional solders. Coupled with an improved coating process, LV2K can be controlled well within the standard 0.5% by weight tolerance limit and ensures a complete and uniform coating. Its capabilities covers most geometries and sizes, and allows for a precise flux content to minimize volatiles while removing surface oxides. LV2K is a drop-in solution that delivers:

• Ultra-low voiding
• Precise control of the flux percentage
• Improved thermal management, structural integrity, and overall end-product reliability

Indium8.9HF solder paste is an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhance electrical reliability, and improve stability during the printing process.

Indium8.9HF:

- Increases electrical reliability via enhanced surface insulation resistance (SIR) that inhibits current leakage and dendritic growth

- Ensures low-voiding on bottom termination components (ex. QFN, DPAK, LGA)

- Delivers supreme product stability with:

• Excellent response-to-pause, even after being left on the stencil for 60 hours
• Enhanced printing and reflow performance after remaining at room temperature for one month
• Consistent printing performance for up to 12 months when refrigerated

- Offers excellent pin-in-paste and through-hole solderability

- Resists premature flux spread to prevent surfaces from oxidizing

Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007e book library here. 

04/27/2022 | Andy Shaughnessy, I-Connect007

I attended SMTA Atlanta Expo and Tech Forum last week, and it’s safe to say that this industry is definitely back in business in the Peach State. The aisles were busy all day, and the presentations were well attended.

03/30/2022 | Andy Shaughnessy, Design007

This year’s theme was “Texas is Open for Business,” and the turnout seemed to reflect that observation. We saw a steady stream of attendees arriving throughout the day, and most of them stayed through the barbecue lunch and happy hour. Dallas SMTA Expo and Tech Forum is becoming much more than a regional show. I met exhibitors and attendees from around the southwest, and a few from across the country. The Plano Event Center has a configurable layout that can accommodate events of all sizes, and next year’s show is expected to be even bigger.

12/02/2021 | Nolan Johnson, I-Connect007

Nolan Johnson speaks with Dr. Ron Lasky About "The Printed Circuit Assembler’s Guide to... Solder Defects." Ron is a full professor at Dartmouth College, but works part-time at Indium Corporation, helping their customers solve defects. This I-Connect007 eBook, he says, is a compilation of all he’s learned over the years as well as the deep technical knowledge of the team at Indium.