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KYZEN to Discuss 3D Printing Process Resin Cleaners at RAPID + TCT
April 29, 2022 | KYZEN'Estimated reading time: Less than a minute
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at RAPID + TCT 2022, scheduled to take place May 17-19, 2022, in Detroit, Michigan. The KYZEN clean team will discuss the KYZEN 3D5701 and KYZEN 3D5420 3D Printing Process TPM Resin Cleaners at Booth #1348.
KYZEN 3D5701 and 3D5420 are cost-effective cleaning chemistries designed for cleaning resin residues remaining from the Stereolithography (SLA) 3D printing process. Both chemistries have proven effective with many standard UV cured resins used in the 3D printing processes.
Environmentally safe, KYZEN 3D5701 and 3D5420 are free rinsing, low odor, and effective at ambient temperature. The resin cleaners are designed for use in spray-in-air and ultrasonic cleaning systems.
Suggested Items
Intel Brings AI-Platform Innovation to Life at the Olympic Games
04/18/2024 | BUSINESS WIREIntel announced its plans for the Olympic and Paralympic Games Paris 2024. Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage.
The Connection Between Wire Harness and Box Build
04/17/2024 | Nolan Johnson, I-Connect007Christina Rutherford is a technical lead and expert in materials engineering at Honeywell, where her specialty is the design, specification, and manufacture of cables and wire harnesses. Rutherford also sits on the committee for IPC/WHMA-A-620. In this conversation, we explore the changing dynamics in wire harnesses and how they relate to box build. Christina’s standards work allows her to draw insightful parallels between wire harness and box build.
Real Time with... IPC APEX EXPO 2024: Innovations in Thermal, Warpage, and Strain Metrology
04/17/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson talks with Neil Hubble, president of Akrometrix, about the company's leadership in thermal, warpage, and strain metrology. Neil details how Akrometrix is committed to addressing customer challenges through technological evolution, innovative solutions, and a focus on data processing. A tabletop unit for thermal warpage testing is showcased at IPC APEX EXPO this year.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Connect the Dots: Designing for Reality: Prioritizing Manufacturability
04/11/2024 | Matt Stevenson -- Column: Connect the DotsRealistic PCB designs should prioritize manufacturability and reliability of the PCB as well as meet the other design requirements. To do so, one must account for the production variables associated with individual manufacturing partners. Understanding and creating robust PCB designs, especially in terms of board manufacturing, requires a lot of attention to detail. When more detail is included in the design, the manufacturing process goes more smoothly, and process yields are higher.