MacDermid Alpha Electronics Solutions to Feature High Reliability Solutions and Recycling Services at SMTA Michigan Expo & Tech Forum


Reading time ( words)

The Assembly Division of MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, will exhibit at the SMTA Michigan Expo & Tech Forum on Tuesday, May 17.

MacDermid Alpha has a portfolio of products proven to meet the most demanding electrical and thermo-mechanical reliability requirements of the automotive industry including solutions for safety, LED lighting, in-cabin electronics, underhood for powertrain related electronic systems, and electric vehicle - power electronics.

“When it comes to customer applications, not everyone has the same needs and requirements. For this reason, MacDermid Alpha has a broad line of solder pastes designed for resistance to both thermo-mechanical fatigue and electrochemical migration,” stated Scott Lewin, Regional Marketing Manager. “We are continually innovating with a portfolio of products proven to meet the most demanding requirements of the automotive industry.”

Alpha and Kester will feature their technologies engineered for enhanced reliability through ALPHA CVP-390V and Kester NP505-HR solder pastes with the industry-leading high-reliability Innolot alloy. Additionally, low-temperature solder pastes including Alpha’s recently launched, ALPHA OM-565 solder paste with HRL3 alloy will be promoted as well as the ALPHA HiTech portfolio of adhesive, underfill, and edgebond solutions. 

In addition, a representative from MacDermid Alpha’s Reclaim and Recycling program will be available to discuss options for processing various types of assembly materials. With over thirty years of experience, MacDermid Alpha is North America’s largest solder manufacturer and recycler of electronics manufacturing waste. “We are committed to creating a more sustainable supply chain,” said Robert Wallace, Director of the Americas Reclaim Business. “We work closely with our customers to support their environmental initiatives for recycled products and managing their waste streams.”

Share




Suggested Items

VJ Electronix: Automating the X-ray Inspection Process

05/04/2022 | Nolan Johnson, I-Connect007
VJ Electronix's Brennan Caissie shares the benefits of a new inspection tool that can be used on a variety of boards, with an automated system that takes the pressure off the manufacturing floor operators and can provide feedback all the way to the design process.

Dave Hillman on Living Your Passion

03/29/2022 | Barry Matties, I-Connect007
Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.

IPC’s Dieter Bergman Fellowship Award Presented to Bev Christian, HDPUG

03/14/2022 | Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Bev Christian is a facilitator for the High Density Packaging User Group (HDPUG) and an adjunct associate professor in the Department of Mechanical and Mechatronics Engineering of the University of Waterloo, Waterloo, Ontario, Canada. In the past 31 years he has held positions at Nortel, BlackBerry, and CALCE; all in the areas of materials and failure analysis. Bev has never missed an IPC APEX EXPO since its inception. He is a member of 27 IPC committees and attends as time and the lack of clones allow.



Copyright © 2022 I-Connect007. All rights reserved.