-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Koh Young Technology Celebrates 20 Years of Innovation
May 3, 2022 | Koh Young TechnologyEstimated reading time: 1 minute
Originating from a passionate team of ten engineers, Koh Young Technology has flourished into the industry leader of True 3D measurement-based inspection solutions. May 2022 will see us celebrate 20 years of innovation! “From being a newcomer in the inspection industry to the global leader in the SPI market took us just three years. This accomplishment is – without doubt – thanks to our team, our customers, and our partners,” reflects Dr. Kwangill Koh, Founder and CEO of Koh Young Technology.
Back in the early 2000s, machines were not dependable enough to inspect printed solder paste or mounted components, so a human worker had to sit at the line, stare at each solder brick and component on a board, and then identify defects with their eyes under a Logo
Description automatically generated magnifying lens. The industry had to replace this manual process with an inspection machine designed with enough software intelligence to substitute a human mind with more accuracy than the human eye. Now, our 3D inspection systems are the de facto standard for inspection and have revolutionized the electronics manufacturing industry.
During our climb to the zenith of the inspection market, we achieved several notable accomplishments along the way. Some of Dr. Koh’s most memorable events include:
- Shifting the inspection market paradigm in 2003 with our 3D solder paste inspection (SPI) system
- Overcoming impossible hurdles to invent 3D automated optical inspection (AOI) in 2010
- Creating the industry’s first A.I. (artificial intelligence) technology that helped build the ultimate smart factory of the future, all the while developing our foray into semiconductor and advanced packaging inspection solutions with the Meister Series in 2017
- Developing the industry’s first in-line dispensing process inspection system in 2021 (Neptune) to inspect the thickness of conformal coating as well as any transparent materials in 2021
“Inventing an innovative technology and shifting an industry paradigm is not a road often taken, yet Koh Young will gladly hop on the path,” commented Dr. Koh. “The unyielding commitment and fighting spirit required to take such paths are in our DNA.”
Additional content from Koh Young:
- The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal
- “Converting Process Data Into Intelligence” by Joel Scutchfield and Ivan Aduna, a free 12-part micro webinar series
- You can also view other titles in our full I-007e book library here
Suggested Items
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.