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Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing solderability testing of components. This technical paper encompasses critically important information about the solderability testing process and is entitled “The Role of Solderability Testing and Its Importance in Successful Soldering.”
Topics covered within this publication include solderability test methods, testing protocols, acceptance criterion, and testing procedures. The dip-and-look qualitative test method and the wetting balance quantitative test method are described in detail as well as the reasons behind the need to perform solderability testing to ensure frobust and reliable solder joints.
Nolan Johnson, I-Connect007
VJ Electronix's Brennan Caissie shares the benefits of a new inspection tool that can be used on a variety of boards, with an automated system that takes the pressure off the manufacturing floor operators and can provide feedback all the way to the design process.
Barry Matties, I-Connect007
Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.
Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Bev Christian is a facilitator for the High Density Packaging User Group (HDPUG) and an adjunct associate professor in the Department of Mechanical and Mechatronics Engineering of the University of Waterloo, Waterloo, Ontario, Canada. In the past 31 years he has held positions at Nortel, BlackBerry, and CALCE; all in the areas of materials and failure analysis. Bev has never missed an IPC APEX EXPO since its inception. He is a member of 27 IPC committees and attends as time and the lack of clones allow.