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The Assembly Division of MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing will discuss solutions for voiding at the SMTA Juarez Expo & Tech Forum on Thursday, May 19.
Customer Technical Engineer, Francisco Gallegos, will present “Solder Void Causes and Industry Reduction Strategies” as part of the Technical Forum. Gallegos will focus on the most common causes of voids in solder joints, addressing the impact of different materials, design, equipment, and solder chemistry, and outlining the different strategies for preventing voids, including traditional solutions through stencil design and reflow profiles. The paper will also address other techniques for void mitigation, such as using solder preforms and vacuum reflow ovens.
MacDermid Alpha will also participate in the Expo, promoting both the Alpha and Kester portfolios for low voiding solutions which can increase reliability, enhance electrical and thermal performance, and eliminate costly rework. Featured solder pastes include ALPHA OM-358 and Kester NP650 and the ALPHA HiTech portfolio of adhesive, underfill, and edgebond solutions.
Download The Printed Circuit Assembler’s Guide to… Low-Temperature Soldering by Morgana Ribas. You can also view other titles in our full I-007e book library here.
Nolan Johnson, I-Connect007
VJ Electronix's Brennan Caissie shares the benefits of a new inspection tool that can be used on a variety of boards, with an automated system that takes the pressure off the manufacturing floor operators and can provide feedback all the way to the design process.
Barry Matties, I-Connect007
Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.
Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Bev Christian is a facilitator for the High Density Packaging User Group (HDPUG) and an adjunct associate professor in the Department of Mechanical and Mechatronics Engineering of the University of Waterloo, Waterloo, Ontario, Canada. In the past 31 years he has held positions at Nortel, BlackBerry, and CALCE; all in the areas of materials and failure analysis. Bev has never missed an IPC APEX EXPO since its inception. He is a member of 27 IPC committees and attends as time and the lack of clones allow.