Gen3’s Dr. Chris Hunt to Present at SMTA Electronics in Harsh Environments Conference


Reading time ( words)

Gen3, a British manufacturer of testing and measuring the electronics industry, announced that Dr Chris Hunt, CTO, will present during the SMTA Electronics in Harsh Environments Conference. The presentation, “Objective Evidence and How to Convince the Auditors,” will take place on Wednesday, May 18, 2022, from 16:30 – 17:00 p.m. at the Park Plaza Victoria Amsterdam.

Gen3’s Dr. Chris Hunt will be addressing the question that everyone is facing in the industry globally, what does ”Objective Evidence “mean/require?

  • This will be a measurement system that will be repeatable and reproducible, and that can have a metric that directly relates to performance.
  • For ECM a suitable metric is resistance.
  • ECM produces corrosion products and ionic current flows that contribute to unwanted circuit elements.
  • A measurement of the isolation resistance between circuit features therefore provides a direct circuit performance metric.
  • SIR and CAF are examples of techniques that measure resistance, and hence provide Objective Evidence .

SIR, for process validation testing, was first established more than 30 years ago. It was a spin-off from the British CFC Elimination Project led by Dr Colin Lea OBE, at the British National Physical Laboratory. With the then advent of no-clean fluxes, it was the only test method to determine electro-chemical reliability and hence acceptable cleanliness as used at that time.

It was recognised as unsuitable for process control and that process ionic contamination testing (PICT) should be maintained for fast and effective control within 15 minutes.

New test methods have been introduced by IEC in the past 2 years:

  • IEC 61189-5-502 – Surface Insulation Resistance (SIR) testing of assemblies - 2021
  • IEC 61189-5-504 – Process Ionic Contamination Testing (PICT) - 2020

Gen3’s presentation will also look at the other test methods and compare their pro’s and con’s, including Ion Chromatography, FTIR, SEM + EDAX and new Digital Microscopy.

 

Additional content from GEN3: 

Share




Suggested Items

Optimizing Test Engineering Practices for High-Mix Electronics Manufacturing

08/01/2022 | Mark Laing, Siemens Digital Industries Software
For PCB and assembly manufacturers, test engineering has become a critical factor in enhancing the profitability of new product introductions (NPIs). Given the trend toward high-mix, low-volume production, the journey from design data to an automated PCB testing program must be quicker and more efficient than ever before. In this article, we will discuss how to optimize the efficiency of the test engineering process in accordance with these new market realities.

Getting Involved Earlier in the Test Process

04/18/2022 | Andy Shaughnessy, I-Connect007
At SMTA Dallas, Andy Shaughnessy stopped by the booth for The Test Connection, to find out from Bert Horner why the company has evolved into spending more time educating and consulting with their customers when it comes to testing new designs.

Automotive Initiatives Make Headway at IPC APEX EXPO

02/25/2022 | Tracy Riggan, IPC
A significant number of automotive activities made notable strides at this year’s IPC APEX EXPO. Several committees dedicated to creating and updating automotive addenda for existing IPC standards, like assembly processes, PCB fabrication, and high-voltage cable, met and were led by companies like Toyota, Bosch, Continental, and Elmatica. Automotive dedicated groups, like the Cold Joining/Press-fit Task Group, also met and discussed inclusions in its next planned revision.



Copyright © 2022 I-Connect007. All rights reserved.