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SMTA Capital Chapter Expo - Advanced Manufacturing on Supply Chain Solutions
May 5, 2022 | SMTAEstimated reading time: 2 minutes
Supply Chain Crisis: When will the Chip Shortage End? What is the solution? Supply Chain issues are prevalent, causing a supply crunch and resulting in cut production, delinquent delivery shortages, and loss of profit. Then there is offshore manufacturing, which poses a security threat as democracy is threatened across the globe. The 2021 National Defense Authorization Act (NDAA) has a call for action to translate American innovation into domestically manufacturable, market-ready technology to provide solutions to the current market threats.
Join us for technical presentations that provide insight on real risk and solutions that meet the 2021 NDAA’s mission and strengthen the U.S. position in electronics research, development, and manufacturing.
Advances in Multi-material Additive Manufacturing - Aaron Sather, Nano Dimension
This presentation discusses the advances in multi-material additive manufacturing technology being applied to electronic circuits and its supply chain benefits. Additive manufacturing provides for rapid prototyping, and onsite manufacturing, is environmentally friendly, and affords design engineers new ways of fabricating electronics. The onsite production capabilities mean that supply chain infrastructure can be made more efficient, shorten cycle time and reduce the risk associated with the sourcing of parts.
Nanoelectronics on Demand - Ahmed Busnaina, Center for High-rate Nanomanufacturing
The cost of building an economically viable fab has reached $20 billion per fab in recent times. The energy intensity of the current semiconductor manufacturing processes is extremely high. Massive amounts of highly corrosive and toxic materials, water, and power used in the making of semiconductors impose an unsustainable environmental burden. Nanoscale additive manufacturing can be implemented as a single tool-line to print integrated circuits at significantly lower cost, higher throughput, and significantly lower environmental impact. This platform has the potential to change the electronics manufacturing landscape to make it material agnostic and capable of printing many materials on demand.
Thermal Reliability of Hydrocarbon Dielectric Build Up Layers - Paul Cooke, AGC
In the last few years, there have been concerns about products requiring high reliability when using microvia structures. As a result, many fabricators have been mandating pushback on very complex high-layer count designs. This has resulted in very conservative rules for designers to use and meet the fabricators' capabilities. This study shows how a thin hydrocarbon dielectric layer can be used and optimized for stacked microvias that demonstrate solid thermal reliability on up to 5 layers of HDI on both sides, it also shows there seems to be no indication yet of a ceiling on how many layers could be used.
Suggested Items
Winner of The Science Show Rakett 69 Receives Incap Scholarship
04/24/2024 | IncapThe winner of the Rakett 69 science show, Andri Türkson, who stood out as an electronics enthusiast, received a scholarship from Incap Estonia, along with an internship opportunity in Saaremaa.
Alternative Manufacturing Inc. Awarded QML Requalification to IPC J-STD-001 and IPC-A-610
04/24/2024 | IPCIPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) requalification to Alternative Manufacturing Inc (AMI).
Boeing's Janene Stinson Earns IPC Excellence in Education Award at IPC APEX EXPO 2024
04/22/2024 | IPCThe IPC Excellence in Education award was presented to Janene Stinson, Boeing, at IPC APEX EXPO 2024 in Anaheim, California, in recognition of her significant contributions to workforce development and leadership.
Zentech’s Board of Directors Announces the Return of Matt Turpin as President and CEO
04/22/2024 | Zentech ManufacturingTurpin draws upon over 35 years of experience in the electronics industry and has an 18-year history with Zentech. He previously served as President and CEO from 2006 to 2019 after which time he has remained active in the EMS industry as an advisor to Zentech and other industry organizations.
IDTechEx Report Unveils 3D Electronics Status and Opportunities
04/22/2024 | PRNewswire3D electronics is an emerging manufacturing approach that enables electronics to be integrated within or onto the surface of objects. 3D electronic manufacturing techniques empower new features, including mass customizability, greater integration, and improved sustainability in the electronics industry.