Indium, KATEK to Present Joint Process Development at SMTconnect


Reading time ( words)

Indium Corporation expert Andreas Karch, regional technical manager and technologist – advanced applications, and Ralf Sedlatschek, head of technology, KATEK Group, will co-present their joint process development on a materials solution to prevent hotspots in thermally-critical components at SMTconnect, May 10, 11:40 a.m. at Nuremberg, Germany. 

In their German-language presentation, Solder Material for Mounting Thermally Critical Components, Karch and Sedlatschek, will share the results of a joint process development project designed to guarantee the prevention of hotspots under thermally critical components utilizing a standard reflow process.

To learn more about Indium Corporation’s suite of proven products, visit indium.com/auto or stop by its booth (#5-320) at the show.

Andreas Karch provides technical support on solder paste and preforms, fluxes, and thermal management materials to Indium Corporation’s customers in Germany, Austria, and Switzerland. Karch has more than 20 years of automotive industry experience in PCB and power electronics, including the advanced development of customized electronics. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Karch is an ECQA-certified integrated design engineer and holds a Six Sigma Yellow Belt. His thorough understanding of process technologies and project management skills reinforces Indium Corporation’s commitment to providing world-class service to its customers in Europe.

Ralf Sedlatschek is the head of technology and radiation protection officer for KATEK Grassau. He is a state-certified engineer with more than 30 years of industry experience. His professional experience includes measurement engineer and quality manager for toolmaking and aviation industries; he has held multiple technical leading positions with KATEK Grassau since joining the company in 2005.

Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007e book library here. 

Share




Suggested Items

Solder Paste Printing and Optimizations for Interconnecting Back Contact Cells

07/26/2022 | Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.

Optimizing Test Engineering Practices for High-Mix Electronics Manufacturing

08/01/2022 | Mark Laing, Siemens Digital Industries Software
For PCB and assembly manufacturers, test engineering has become a critical factor in enhancing the profitability of new product introductions (NPIs). Given the trend toward high-mix, low-volume production, the journey from design data to an automated PCB testing program must be quicker and more efficient than ever before. In this article, we will discuss how to optimize the efficiency of the test engineering process in accordance with these new market realities.

Time to Get Serious About CMMC Readiness

07/13/2022 | I-Connect007 Editorial Team
Divyash Patel of MX2 Technology is a leading cybersecurity expert who’s sounding the alarm about getting your company into a state of readiness. But he’s not yelling fire in a theater. Whether it’s aligning with DoD’s CMMC, or just ensuring your company’s data and processes are protected, Divyash can see what’s coming. “This is a must-have compliance program,” he says. “It needs to be taken seriously and maintained.”



Copyright © 2022 I-Connect007. All rights reserved.