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MacDermid Alpha Electronics Solutions, a world leader in the production of innovative materials used in semiconductor, circuitry, and electronics assembly announces the release of ALPHA HRL3 Solder Sphere, lead-free, high reliability, low-temperature alloy for ball mount applications.
ALPHA HRL3 is a lead-free, low temperature, high-reliability alloy for use applications where low-temperature processing is desired. ALPHA HRL3 is available in solder sphere format for ball mount application. The alloy was designed to exhibit improved drop shock and thermal cycling performance versus existing low-temperature alloys in the market. The ALPHA HRL3 Solder Spheres offer a wide operating window, cost savings through low-temperature materials and heating energy while reducing warpage.
ALPHA HRL3 Solder Spheres is a high-quality lead-free alloy that is capable of soldering at a temperature lower than standard tin silver-copper alloys. ALPHA HRL3 solder alloy is able to demonstrate reliability performance comparable to standard tin silver copper alloys (SAC305). To ensure consistent sphere size, uniformity, and alloy content, ALPHA Solder Spheres are manufactured to the highest quality control standards.
Download The Printed Circuit Assembler’s Guide to… Low-Temperature Soldering by Morgana Ribas. You can also view other titles in our full I-007e book library here.
Nolan Johnson, I-Connect007
VJ Electronix's Brennan Caissie shares the benefits of a new inspection tool that can be used on a variety of boards, with an automated system that takes the pressure off the manufacturing floor operators and can provide feedback all the way to the design process.
Barry Matties, I-Connect007
Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.
Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Bev Christian is a facilitator for the High Density Packaging User Group (HDPUG) and an adjunct associate professor in the Department of Mechanical and Mechatronics Engineering of the University of Waterloo, Waterloo, Ontario, Canada. In the past 31 years he has held positions at Nortel, BlackBerry, and CALCE; all in the areas of materials and failure analysis. Bev has never missed an IPC APEX EXPO since its inception. He is a member of 27 IPC committees and attends as time and the lack of clones allow.