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IPC presented Committee Leadership and Distinguished Committee Service Awards on May 9 at IPC’s SummerCom Standards Development Committee Meetings in Milwaukee, Wis. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise in the development of electronics manufacturing standards.
For his leadership of the D-55a Embedded Circuitry Guideline Task Group that revised IPC-7092A, Design and Assembly Process Implementation for Embedded Circuitry, Bhanu Sood, NASA Goddard Space Flight Center, earned a Committee Leadership Award. For their contributions to IPC-7092A, a Distinguished Committee Service Award was presented to Mumtaz Bora, Peregrine Semiconductor; Francesco Di Maio, GESTLABS S.r.l.; Gary Erickson, Sanmina Corporation; Dennis Fritz, Fritz Consulting; Ife Hsu, Intel; Manoj Kakade, pSemi Corp.; Rajesh Kumar, TTM Technologies; John Lauffer, TTM Technologies; Karen McConnell, Northrop Grumman; and Benjamin Piepgrass, Southwest Research Institute.
For his leadership of the B-11a 3D Electronic Packages Guideline Task Group that revised IPC-7091A, Design and Assembly Process Implementation of 3D Components, Dudi Amir, Intel Corporation, earned a Committee Leadership Award. For their contributions to IPC-7091A, Francesco Di Maio, GESTLABS S.r.l.; Ife Hsu, Intel; Russell Kido, Practical Components Inc.; Gustaf Martensson, Mycronic AB; Steve Martell, Nordson ASYMTEK; Jeff Schake, ASM Assembly Systems; Vern Solberg, Solberg Technical Consulting; Bhanu Sood, NASA Goddard Space Flight Center; and Pietro Vergine, Advanced Rework Technology Ltd., earned a Distinguished Committee Service Award.
For their leadership of the 5-24g Polymerics Standard Task Group that developed IPC-5262, Design, Critical Process and Acceptance Requirements for Polymeric Applications, a Committee Leadership Award was presented to Bob Cooke, NASA Johnson Space Center and Christina Rutherford, Honeywell Aerospace. For their contributions to IPC-5262, Tiberiu Baranyi, Flextronics Romania SRL; James Blanche, NASA Marshall Space Flight Center; Gerald Bogert, Bechtel Plant Machinery, Inc.; Brian Chislea, Dow Corning; Torrey Clark, Dow; Francesco Di Maio, GESTLABS S.r.l.; Lloyd Duso, Diamond-MT, Inc.; Hans-Otto Fickenscher, Vitesco Technologies Germany GmbH; Eric Harenburg, Boeing Company; Dave Hillman, Collins Aerospace; Joseph Kane, BAE Systems; Paul Kirpes, Los Alamos National Laboratory; Kent Larson, Dow; Hannah Locken, Boeing Company; Scott Meyer, UTAS/GOODRICH CORP. SIS; Garry McGuire, NASA Marshall Space Flight Center; Doug Pauls, Collins Aerospace; Stanton Rak, SF Rak Company; Jonathon Vermillion, Ball Aerospace & Technologies Corp.; Dan White, Collins Aerospace; and Paul Zutter, U.S. Army Aviation & Missile Command, received a Distinguished Committee Service Award.
For their leadership of the D-13, Flexible Circuits Base Materials Subcommittee that developed IPC-4202, Specification for Flexible Base Dielectrics for Use in Flexible Printed Boards, Steven Bowles, Lockheed Martin Corp. and Richard Wessel, DuPont Electronics & Imaging, earned a Committee Leadership Award. Contributions to IPC-4202 earned James Blanche, NASA Marshall Space Flight Center; James Daggett, Raytheon Company; Stefan Hanigk, Ariane Group GmbH; Lawino Kagumba, Blueshift Materials Inc.; Pierre Kuyl, Daikin America; Russ Shepherd, NTS Anaheim; and Jonathon Vermillion, Ball Aerospace & Technologies Corp. a Distinguished Committee Service Award.
For leadership of the 5-24A Flux Specifications Task Group that revised IPC J-STD-004C, Requirements for Soldering Fluxes, Tony Lentz, FCT Assembly Inc. and
Keith Sellers, NTS Baltimore, were presented with a Committee Leadership Award. A Distinguished Committee Service Award was presented to Jasbir Bath, Koki Solder America and Jennie Hwang, H-Technologies Group, for their contributions to IPC J-STD-004C.