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AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the release of its new AIM LUXTM Product Line.
As a leading supplier to the miniLED industry, AIM designed its LUX solder materials to provide tier one manufacturers of LED, miniLED and hi-power LED assemblies with solder pastes and alloys to solve production challenges associated with these applications.
The LUX product line pairs ultra-fine SAC-based and silver-free Type 6, 7 and 8 alloy powders along with innovative flux chemistries. AIM’s NC259 series is proven to provide excellent soldering performance and high production yields. When combined with the SN100C® alloy, NC259 solder pastes eliminate silver migration concerns. AIM REL61TM is a low-silver alloy option that can lower peak reflow temperature requirements and improve mechanical strength over other low/no-silver alloys. For high-power LEDs, AIM's REL22TM doubles the service life under extreme thermal cycling conditions. AIM's Tacky Flux offers high tack forces, long open time, and improved wetting for all mass transfer and high-speed dipping applications.
“The Mini/MicroLED market is poised to experience exponential growth over the next 2-3 years,” said Timothy O’Neill, AIM’s Director of Product Management. “AIM LUX product line has been developed specifically to meet the needs of current and emerging technologies.”
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