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PVA, a global supplier of automated dispensing and coating equipment, is pleased to announce that it received a new patent in Japan for an “optical bonding machine having cure in place and visual feedback.” The new patent is based upon a machine and method designed specifically for applying a UV cure liquid optically clear adhesive used for bonding cover glass and/or sensors to touchscreens used most commonly in the automotive, aerospace, military, and medical applications. Key features covered by the patent are related to machine design and methods used.
This method integrates UV curing into the machine to bond the assembly without having to transfer to another station and risk causing defects. It uses a clear datum to hold the base substrate and a robotic placement head to perform the assembly.
Additionally, this method includes a video display of the dispensing and assembly process. Video/image inspection of the bonded assembly shows defects such as bubbles, voids, dust, foreign particles, scratches, etc.
PVA is a world-class innovator of high-quality, repeatable dispensing and conformal coating systems. The company manufactures turnkey solutions that help customers improve their competitiveness, such as coating inspection, optical bonding and curing ovens.
Michelle Te, I-Connect007
It’s officially fall, and that means it's time to start planning your trade show attendance. To help you make decisions about when and where to go, we’ve put together a list of industry trade shows. It has been two long years with no or few in-person trade shows, and we’ve felt it. So, now we’re back in business and ready to hit the road. Do you have a show or conference to add to our list? Let us know!
I-Connect007 Editorial Team
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.
Mark Laing, Siemens Digital Industries Software
New product introductions (NPIs) and customization have been increasing rapidly over the past few years—with the results that the already-small profit margins in electronics assembly are shrinking even further. Fifteen years ago, the PCB was the product. Today, most products are a system, with multiple PCBs, cables, and enclosures. Many manufacturers want to provide turn-key products that have multiple BOMs, making the assembly process even more complicated.