Arch Systems Names Benjamin Freeman VP of Engineering

Reading time ( words)

Arch Systems, the leading provider of machine data and analytics for electronics assembly operations, announced the appointment of Benjamin Freeman to Vice President of Engineering. The company is in an active hiring phase as a result of significant growth.

An experienced, driven R&D leader, Freeman has a track record for growing great concepts into great businesses. He specializes in analytics and technology-assisted optimization of physical processes. Freeman’s background includes driving collaboration across business functions, from finance, sales and customer success, to software development and R&D, to industrial engineering and operations.

“Arch is well on its way to becoming the leading manufacturing data analytics platform provider and I’m thrilled to be joining this award-winning team,” said Freeman. Tim Burke, Arch CTO and co-founder, shared those sentiments, “Ben is a great fit for Arch and his presence further positions Arch as a market leader. We are very excited to have him leading our engineering teams as we experience unprecedented demand and growth.”

Freeman has specialized in software engineering for 23 years. He started out at Oracle, Inc. in 1999. Since, he has held numerous upper-level software engineering roles at respected companies, including his most recent position as Executive Director of Engineering and Planning at Ingram Micro/Shipwire. Here, he was responsible for the development and planning lifecycle of eCommerce Fulfillment. He also helped the company’s US-based development team establish an international footprint.

Arch is a recipient of the 2021 Global Technology and Mexico Technology Awards, and a 2022 NPI Award. The ArchFX Platform provides the machine connectivity, data management, and advanced insights needed to achieve digital transformation across the manufacturing organization

03/03/2023 | Happy Holden, I-Connect007

We were back in San Diego, maybe for a “long vacation,” as IPC APEX EXPO is in Anaheim next year. Before we get to Anaheim, though, let’s talk about the show: It was a great week. I spent Sunday and Monday visiting some excellent Professional Development courses. As you know, this is a fast-changing industry, and we have to keep learning to stay ahead. On Monday, I attended the Microvia Weak Interface/Reliability subcommittee, and on Tuesday, the Ultra-HDI Technology Committee.

12/28/2022 | Nolan Johnson, I-Connect007

Nolan Johnson checks in with Sean Langbridge, European sales director for CyberOptics, at electronica to discuss details of the recent merger between CyberOptics and Nordson and the partnership’s potential benefits for customers, especially regarding solutions geared toward enhancing the accuracy of test and inspection in advanced packaging. The company’s unique optical technologies, including its MRS sensors and AI² software, are already saving customers hours on the line; with Nordson’s X-ray capabilities in the mix, CyberOptics sees some very compelling technological solutions on the horizon.

12/28/2022 | Pete Starkey, I-Connect007

Pete Starkey talks with Kevin Domancich at Essemtec at electronica 2022 about the company integration within Nano Dimension and how the two companies have pioneered an exciting new end-to-end manufacturing solution that helps customers speed up production, cut costs, and keep their proprietary materials secure. In a world where time to market has become a priority consideration, this universal system has the potential to revolutionize the industry.