Indium Corporation to Feature Proven Products at iMAPS SiP Conference

Reading time ( words)

Indium Corporation will feature products from its portfolio of system-in-package material solutions at the Advanced System in Package Technology Conference & Exhibition, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), on Tuesday, June 21 in Sonoma, Calif., U.S.

From water-soluble to no-clean soldering solutions, flip-chip fluxes, and novel mixed alloy technologies, Indium Corporation’s portfolio of products meets current and evolving challenges encountered in fine-pitch SiP and heterogeneous integration and assembly (HIA) applications.

Indium Corporation’s proven SiPaste® series is specifically designed for fine-feature printing with fine powders ranging from Type 5 to Type 7. They help Avoid the Void®, reduce slumps, and demonstrate consistent superior printing performance. Water-soluble SiPaste® 3.2HF has been adopted by leading OSATs and has been used in more than 5 billion mobile FEM SiP modules. SiPaste® C201HF offers the same superior printing performance with the benefit of having a cleanable chemistry with semi-aqueous-based solutions.

SiPaste® 3.2HF formulation offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of today’s miniaturization in SiP design. In addition to consistent printing and reflow requirements, this solder paste offers superb wetting to the various Pb-free metallizations and has exceptional low-voiding performance on fine-pitch components, including BGAs and CSPs.

  • Exceptional printing
  • Long stencil life
  • Good response-to-pause
  • Wide reflow profile window
  • Outstanding slump resistance
  • Excellent wetting capability
  • Superior fine-pitch soldering ability
  • Low-voiding
  • Halogen-free

SiPaste® C201HF exhibits many of these same benefits, with particular formulation consideration to provide exceptional paste release on sub-80-micron apertures, stable print performance leading to long stencil life, and high tackiness to prevent component shift. This combines with a cleanable chemistry with semi-aqueous-based solutions, allowing for ease of cleaning with minimal cost.

Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007e book library here. 



Suggested Items

Mining for Metals Requires a Long View

06/15/2022 | Nolan Johnson, I-Connect007
Nolan Johnson talks with Shaun Dykes, a 50-year expert in the mining industry. Dykes gives a concise primer on mining development, and the amount of time and effort required to develop and supply the mineral resources we depend upon for the manufacture of printed circuit boards. There are many factors that play into when and where a mine is developed—and what can prevent a mine from ever producing minerals.

Book Excerpt: 'The Printed Circuit Assembler’s Guide to… Solder Defects'

06/07/2022 | I-Connect007 Editorial Team
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.

VJ Electronix: Automating the X-ray Inspection Process

05/04/2022 | Nolan Johnson, I-Connect007
VJ Electronix's Brennan Caissie shares the benefits of a new inspection tool that can be used on a variety of boards, with an automated system that takes the pressure off the manufacturing floor operators and can provide feedback all the way to the design process.

Copyright © 2022 I-Connect007. All rights reserved.