I-Connect007 Editor’s Picks: Five Must-Reads for the Week

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PCB fabrication is back in the news this week and posting high readership numbers as well. Among the most-read news, we see industry leaders changing roles, capital equipment shipment milestones, operational cost efficiencies, and, last but not least, cybersecurity.  

Mike Carano Joins the Averatek Team as Vice President of Quality 
Published June 3 

As a former VI at RBP Chemical Technology, and Global R&D director at OM Group, as well as an influential advisor for IPC, I-Connect007 columnist Mike Carano brings a deep skillset to this new role with Averatek. Read the details here. 

The Double-edged Sword of CMMC 2.0 
Published June 6 

MX2 Technology’s Divyash Patel updates readers on CMMC (Cybersecurity Maturity Model Certification) overall, and the upcoming version 2.0 criteria specifically. Given the likelihood that CMMC will touch most of us in the industry eventually, readers clearly wanted to know more. 

Atotech Sells 1,000th Horizontal Electrolytic Copper Plater 
Published June 8 

Atotech announced the sale of its 1,000th installation of the Uniplate horizontal plating line to a Taiwan-based PCB manufacturer. The article also includes a timeline of milestones in the Uniplate line.  

Isola Lays Groundwork for Faster, Higher-Frequency Circuits at 2022 IMS 
Published June 7 

If you’re visiting the 2022 IEEE International Microwave Symposium in Denver, Colorado, June 21-23, Isola will be present, discussing hybrid design and fabrication and dielectric constants in materials. Readership was high for this article; find the details inside. 

Candor Nails the ROI With InduBond 
Published June 7 

Sunny Patel is engineering manager at Candor Industries. We follow up on Sunny Patel’s initial interview about the economics of this new InduBond X-Press 360 lamination press. It sounds like Sunny has hit the “easy” button with the installation of this machine.



Suggested Items

The Growing Need for UHDI

11/30/2022 | I-Connect007 Editorial Team
Jan Pedersen of NCAB Group is deeply involved in IPC standards development surrounding ultra HDI and keeps his finger on the pulse of the industry surrounding this type of fabrication. With Asia still dominating this area, Jan sees the need for U.S. and European PCB fabricators to make the investment if they want to stay competitive.

Understanding the UHDI Market

11/28/2022 | I-Connect007 Editorial Team
The more we investigate UHDI in the current market, the more advanced packaging becomes a part of the conversation. Yet there are so many questions to be answered. The I-Connect007 Editorial Team met with Calumet’s Todd Brassard and Meredith LaBeau recently to get answers to these questions and find out where the UHDI market is headed.

Electronica 2022: Happy to Be Back in Munich

11/21/2022 | Pete Starkey, I-Connect007
As we stepped out of the hotel into the drizzling rain, we were relieved that it wasn’t snow. Looking down the escalator into the U2 platform in Munich’s Hauptbahnhof central station early on the morning of Tuesday, Nov. 15 and observing the mass of humanity pushing and shoving to cram into trains to the exhibition centre, it appeared that a significant proportion of the international electronics industry had gathered to attend electronica 2022, co-located with SEMICON Europa and recognised as the world’s leading trade fair and conference for electronics.

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