Reading time ( words)
The last few months have seen a resurgence in industry events and it’s been great to be out and about meeting people in person again. We have been fortunate to have been invited to speak at some of the events.
Chris Day has been presenting the 'Do's, Don'ts and Maybe's of launching new electronic products to market’, most recently he could be found speaking at the Electronic Component Show, alongside Steve Drew, of TechNes, as they covered Design and Manufacturing considerations from original product definition through to production, including, the most important things to consider, along with some of the pitfalls and challenges of electronics hardware development.
Steve Pittom and Steve Blythe were invited to share Jaltek’s experiences in relation to ‘How to grow your Business as an SME’ at the Bedfordshire SME Breakfast event, organised by the Bedfordshire Chamber of Commerce and WMG (The University of Warwick). CoC’s Justin Richardson Chaired the event and WMG’s Mark Swift and Helena Simmonds lead the presentations speaking about WMG’s latest activities including their work on Net Zero Manufacturing.
Barry Matties, I-Connect007
Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.
Patty Goldman, I-Connect007
Doug Pauls holds a B.A. in chemistry and physics from Carthage College, Kenosha, Wisconsin, and a B.S. in electrical engineering from the University of Wisconsin, Madison. He worked nine years for the Navy, eight years as technical director of Contamination Studies Labs, and 19 years at Rockwell Collins (now Collins Aerospace), in the Advanced Operations Engineering group, where he is a principal materials and process engineer. Doug was awarded the Rockwell Collins Arthur A. Collins Engineer of the Year Award in 2004.
Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Bev Christian is a facilitator for the High Density Packaging User Group (HDPUG) and an adjunct associate professor in the Department of Mechanical and Mechatronics Engineering of the University of Waterloo, Waterloo, Ontario, Canada. In the past 31 years he has held positions at Nortel, BlackBerry, and CALCE; all in the areas of materials and failure analysis. Bev has never missed an IPC APEX EXPO since its inception. He is a member of 27 IPC committees and attends as time and the lack of clones allow.