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The U.S. Patent and Trademark Office has issued Patent No. 10,780,516 protecting Electrovert’s DwellFlex 4.0 Variable Contact Wave Solder Nozzle. Invented by ITW EAE engineers, John Dautenhahn and Greg Hueste, the DwellFlex 4.0 is the first nozzle that allows the wave width to be adjusted on-the-fly variable board types are run through the wave. This ensures solder contact time is optimized for a high mix of board types without losing production time to change conveyor speeds.
Optimizing the length of time the PCB is in contact with the wave is critical to achieving proper topside hole fill without introducing copper dissolution. DwellFlex 4.0’s software compares the recipes between the products and adjusts the wave contact length, pump speed, blower speeds, and fluxer settings on-the-fly as needed. It takes less than ten seconds to make the adjustment between high mass and low mass boards and ensure superior solder results.
DwellFlex 4.0 is a single wave solution that includes both the turbulent and laminar dynamics of the wave within one continuous solder wave, eliminating the temperature drop that occurs between typical dual-wave configurations This single wave solution improves nozzle efficiency, promotes better topside hole fill, and reduces flux degradation.
Nolan Johnson, I-Connect007
Clemens Jargon, senior vice president of High Flex at Mycronic, shares his thoughts about the company’s performance in 2022 (it was a strong year), plans for the new year (turnkey solutions), and what visitors to the Mycronic booth at the show can expect to see in the company’s state-of-the-art Iris™ 3D AOI vision technology.
Andy Shaughnessy, I-Connect007
In this Q&A, Rob Rowland, director of engineering at Axiom Electronics, discusses his new IPC APEX EXPO Professional Development course, “Reflow Profiling Simplified,” on how to create a standardized methodology to accurately generate new reflow soldering profiles. Rob explains, “In this class, I’ll explain how I approached this work to help others develop similar methodologies for creating their own reflow soldering profiles. My presentation also includes the basic reflow profile recipes I have been using for the past 20 years.”
Pete Starkey, I-Connect007
Pete Starkey talks with Kevin Domancich at Essemtec at electronica 2022 about the company integration within Nano Dimension and how the two companies have pioneered an exciting new end-to-end manufacturing solution that helps customers speed up production, cut costs, and keep their proprietary materials secure. In a world where time to market has become a priority consideration, this universal system has the potential to revolutionize the industry.