-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Altus Looks Back at Ten Years of 3D SPI Innovation
June 20, 2022 | Altus GroupEstimated reading time: 1 minute
3D Solder Paste Inspection (SPI) systems have been a game-changer in reliable electronics, ensuring that complex PCBAs are fail-safe. A trailblazer for this innovative inspection is Koh Young. Recently celebrating 20 years of innovation and ten years since they introduced the concept of 3D measurement-based solder paste inspection, Altus, a leading distributor of capital equipment in the UK and Ireland, looks back at how 3D SPI has revolutionized the inspection industry.
Joe Booth, Altus CEO, said: “During the last ten years, we have seen an increase in manufacturers investing in 3D SPI systems. As technology has advanced and electronics have become more complex, the value of the 3D measurement data has increased. The data not only helps to ensure high quality print processes and production results, but it also improves reliability, quality and performance of the PCBA. Investment in 3D SPI is no longer an optional extra but a necessity on any SMT line.”
Since the Koh Young systems use light measurement, they produce the most accurate measurements of a PCBA; therefore it can be used to set the tightest tolerances. This results in better quality inspection, PCBA quality and a large reduction in false calls. Thanks to this intelligent automated technology which has the highest level of connectivity for all the inspection stations, overall automation capability is enhanced.
“Smart customers know that investing in an SPI often leads to the highest return on investment of any inspection or test process in production,” said Joe Booth. “They know this because it offers the earliest opportunity to ensure that solder paste performance is optimised and any failures are caught early before the cost of correcting those errors significantly increases.
“It is widely accepted that 70-80% of SMT production errors are linked to solder paste and, so controlling that aspect of a line has always and will remain a priority. SPI is where Koh Young began full 3D metrology, and now, one of every two SPIs sold globally is a Koh Young platform. This market dominance is reflected in the UK and Ireland by the consistent sales performance over the years, and the saturation effect we see with many sites utilising both Koh Young SPI and AOI on all their production lines.”
Suggested Items
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.