Southwest Systems Technology Now Offers X-ray Inspection from VJ Electronix


Reading time ( words)

Southwest Systems Technology, Inc., the leading manufacturing resource for the Southwest, is pleased to announce that it now represents VJ Electronix, Inc. X-ray inspection systems in the states of Texas, Oklahoma, Arkansas and Louisiana. VJ Electronix provides advanced X-ray inspection, rework technologies and component counting systems. Southwest Systems will offer VJ Electronix manual and fully automated inspection systems for applications such as PCB assembly, semiconductor packages, electromechanical assemblies, biomedical/pharmaceuticals, batteries and more.

Southwest Systems will provide sales and support for VJE’s APOGEE 90 microfocus X-ray inspection system, an advanced at-line NDT solution for manual (MXI) or semi-automated Inspection (AXI) of printed circuit boards, components and assemblies. The system is equipped with a 90kV, sealed, microfocus X-ray source that can achieve a spot size as small as 4µm, a 5” HD Digital Flat Panel Detector with 85µm resolution, and 6-axis motorized motion control with oblique angle inspection of up to 45°.

The APOGEE 90 offers optimal performance and operability at a fraction of the cost of comparable X-ray inspection systems. Creatively designed with the superior resolution and automation typically found in higher cost systems, the APOGEE 90 is one of the most powerful and economical X-ray inspection systems to hit the market in 2022.

For more than 33 years, Southwest Systems Technology has been providing sales and service for equipment and materials in both the electronic assembly and semiconductor manufacturing industries. Southwest Systems’ sales engineers are trained in the latest industry processes and technologies.

Share




Suggested Items

Book Excerpt: 'The Printed Circuit Assembler’s Guide to… Solder Defects'

06/07/2022 | I-Connect007 Editorial Team
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.

How to Minimize Quoting Time and Increase Accuracy in EMS Production

03/30/2022 | Mark Laing, Siemens Digital Industries Software
New product introductions (NPIs) and customization have been increasing rapidly over the past few years—with the results that the already-small profit margins in electronics assembly are shrinking even further. Fifteen years ago, the PCB was the product. Today, most products are a system, with multiple PCBs, cables, and enclosures. Many manufacturers want to provide turn-key products that have multiple BOMs, making the assembly process even more complicated.

A Hard Look at Strategic Chip Investment

03/03/2022 | I-Connect007 Editorial Team
Jan Vardaman is a key contributing author to an IPC report detailing the capabilities gap in advanced packaging capabilities in the U.S. manufacturing ecosystem. We talked with Jan about the report and the current dynamics in the U.S. market. Jan’s comments provide additional detail and insight to the findings published in the report.



Copyright © 2022 I-Connect007. All rights reserved.