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Thermaltronics USA, Inc. is pleased to announce that its solder robots go through extensive quality control procedures in order to maintain the company’s position as the most awarded, accurate and versatile solder robot on the market.
Thermaltronics embraces both strict quality control and conformance with International Manufacturing Standards, is in compliance with ISO 9000 & ISO 14000 and holds certification in TuV, GS, NRTL & CE.
Thermaltronics manufactures and supplies a wide range of soldering products and accessories used in the electronics manufacturing industry. Design and development is undertaken in the USA and Australia, with final production taking place in a customized manufacturing facility, incorporating specialized equipment and in accordance with recognized international standards of quality and compliance.
The Thermaltronics Robot System incorporates innovative design concepts and precision components to ensure accuracy. The combination of high precision hardware and intelligent software ensures precision soldering and low operator training costs.
Unlike typical Cartesian robots the Thermaltronics Robot, Model TMT-R9900S, is equipped with full vision to verify the procedure being undertaken and does not simply follow a pre-determined program. In this respect it has an observation mode, a verification mode and as a result – a decision making capability. This capability of collecting and utilizing data for production processing is one of the most important factors necessary to meet the requirements of Industry 4.0 standards.
Andy Shaughnessy, I-Connect007
I recently spoke with Rob Boguski, president of Fremont, California-based Datest and an SMTA vice president and board member. Rob explained why today’s test customers are asking for more information than the traditional pass/fail, offers a preview of SMTA International, and gives an update on SMTA’s planning strategy for the next five years.
Dr. Ronald C. Lasky, Indium Corp.
It may be difficult to see any bright spots in the current and recent economic situation. We have all experienced the devastation of the pandemic, supply chain issues, and most recently, inflation. However, as a senior technologist for an international materials supplier (Indium Corporation) and a professor of engineering at an Ivy League research university (Dartmouth College), I offer these four silver linings for those of us in the electronics industry.
Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.