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Indium Corporation is pleased to announce that Brian Rundell has joined the company as a Technical Support Engineer based at the company’s headquarters in Clinton, New York.
Rundell is responsible for providing technical assistance to current and potential customers to resolve soldering process-related issues. This includes assisting with the optimization of Indium Corporation’s soldering materials in addition to providing product and process training.
Rundell brings more than 19 years of industry experience to Indium Corporation. Prior to joining the company, he spent ten years leading the manufacturing process development, qualification, and production support of circuit board assemblies for space and military applications. Some of his major accomplishments include directing efforts from prototype assembly through flight production on modules for the Navy’s Air and Missile Defense Radar system and Eutelsat Quantum communications satellite. He earned his bachelor’s degree in electrical engineering from Syracuse University and is a Six Sigma Green Belt.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007e book library here.
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The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.
Mark Laing, Siemens Digital Industries Software
For PCB and assembly manufacturers, test engineering has become a critical factor in enhancing the profitability of new product introductions (NPIs). Given the trend toward high-mix, low-volume production, the journey from design data to an automated PCB testing program must be quicker and more efficient than ever before. In this article, we will discuss how to optimize the efficiency of the test engineering process in accordance with these new market realities.
I-Connect007 Editorial Team
Divyash Patel of MX2 Technology is a leading cybersecurity expert who’s sounding the alarm about getting your company into a state of readiness. But he’s not yelling fire in a theater. Whether it’s aligning with DoD’s CMMC, or just ensuring your company’s data and processes are protected, Divyash can see what’s coming. “This is a must-have compliance program,” he says. “It needs to be taken seriously and maintained.”