Kodiak Assembly Solutions Helps Customer Build Award-Winning Tech


Reading time ( words)

Kodiak Assembly Solutions LP, a leading contract electronic manufacturer, announces that its longtime customer, NXP Semiconductors, was awarded “Best in Show” at Embedded World Germany for their new development tool, Greenbox3, produced by Kodiak Assembly Solutions.

“NXP Semiconductors’ new family of processors is targeted at applications that will be in the next generation of autonomous vehicles. Kodiak made these development tools for NXP and they won “Best in Show” for the Hardware category,” commented Mike Harlow, Vice President/Sales, Kodiak Assembly Solutions. “Kodiak is NXP’s ‘go to’ partner when developing their more sophisticated development tools.”

GreenBox 3 is a versatile development platform for S32Z2/E2 high-performance real-time processors that integrates processing, peripherals, networking and connectivity interfaces in a rugged enclosure.

The GreenBox 3 is ideal for development and demonstrations of integrated and isolated real-time applications such as vehicle dynamics, battery and energy management, motor inverter control and power conversion for central, domain and zonal architectures.

Over the past 16 years, Kodiak Assembly has established a reputation for its high-quality, first pass yields and on-time deliveries. The company offers PCB assembly, test and system integration capabilities out of its world-class facility in Austin.

Kodiak Assembly’s expertise and flexibility allow the company to facilitate the effective production of a great variety of products. The company is built around the idea of being able to quickly begin production of high-quality electronic products while also sticking to the most demanding schedule.

Kodiak has extensive experience in a number of key electronic markets, including Internet of Things (IoT), Network Servers, LED Lighting, Energy Management & Storage, Oil and Gas, Industrial controls, Radio Frequency (RF) Solutions, Security/Access Controls and Microprocessor Embedded Computer Assemblies.

Share




Suggested Items

Book Excerpt: 'The Printed Circuit Assembler’s Guide to… Solder Defects'

06/07/2022 | I-Connect007 Editorial Team
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.

How to Minimize Quoting Time and Increase Accuracy in EMS Production

03/30/2022 | Mark Laing, Siemens Digital Industries Software
New product introductions (NPIs) and customization have been increasing rapidly over the past few years—with the results that the already-small profit margins in electronics assembly are shrinking even further. Fifteen years ago, the PCB was the product. Today, most products are a system, with multiple PCBs, cables, and enclosures. Many manufacturers want to provide turn-key products that have multiple BOMs, making the assembly process even more complicated.

A Hard Look at Strategic Chip Investment

03/03/2022 | I-Connect007 Editorial Team
Jan Vardaman is a key contributing author to an IPC report detailing the capabilities gap in advanced packaging capabilities in the U.S. manufacturing ecosystem. We talked with Jan about the report and the current dynamics in the U.S. market. Jan’s comments provide additional detail and insight to the findings published in the report.



Copyright © 2022 I-Connect007. All rights reserved.