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IPC issued the following statement from President and CEO John Mitchell on today’s passage of the “CHIPS+” legislation in the U.S. House of Representatives, which follows Senate approval and paves the way to U.S. President Joe Biden’s signature:
“IPC, which is committed to building electronics better, welcomes the final passage of the bipartisan “CHIPS+” legislation, which will help America rebuild a critical part of the U.S. electronics supply chain.
“This much-needed legislation is great news for electronics manufacturers. Our members will have opportunities to secure funding for research and development (R&D), new and improved facilities, and critical workforce training through the programs authorized by the bill. In today’s high-tech world, America depends on advanced electronics; this bill strengthens the industry.
“We are particularly pleased that the bill includes investments in building U.S. advanced packaging capabilities, including at least $2.5 billion for a new National Advanced Packaging Manufacturing Program. Bolstering advanced packaging in the United States is critical to securing a reliable and innovative semiconductor supply chain. Without it, U.S.-made chips will still need to be sent offshore for packaging and assembly.
“We are pleased that both chambers of Congress were able to come together and pass this bill with bipartisan consensus. We hope policymakers from both parties agree and will work on helping rebuild the entire U.S. electronics manufacturing ecosystem.”