AIM to Highlight V9 at SMTA Querétaro Expo


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AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming SMTA Querétaro Chapter Expo, taking place on August 18th at Mision Grand Juriquilla. AIM will highlight V9, their new ultra-low-voiding, no clean paste, along with their full line of solder assembly materials.

Formulated to solve one of the industry’s most difficult challenges, V9 has proven to reduce voiding to as low as 1% on BGA and <5% on BTC components while exhibiting stable print performance on fine feature devices over 12 hours. V9 post-process residue is easily probed and possesses high SIR values required for high reliability applications.

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