I-Connect007 Editor’s Choice: Five Must-Reads for the Week


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By now, you have probably heard that I-Connect007 has joined forces with IPC; Andy Shaughnessy led with that news in his Top 5 last week. I-Connect007 is constantly the source of news in the industry, but it’s not often that we’re the subject of the news. This week, it’s a different story.  

To top it off, this week has been particularly newsy. So, I’m making the executive decision to include the merger news item as a piece of bonus news. If you haven’t read the July 28, 2022 press release by now, you’re getting another chance to find it here: 

IPC Acquires Media Company I-Connect007, Strengthening Relationship to Drive Growth and Innovation in the Electronics Industry  

The Top 5 list this week contains industry analysis from IPC’s Shawn DuBravac, news on the passage of the U.S. “CHIPS Plus” bill, new materials from Ventec, and a chemistry company completing their acquisition, plus a brand new book in the I-Connect007 eBooks series.  

We’ll see you next week, and for many weeks to come (we promise!)  

'CHIPS Plus' Bill Passed with IPC’s Active Support 
Published August 2 

From the press release, this passage jumps out, “IPC advocated strongly for the passage of legislation that would fund the CHIPS Act and urged Congress to include  $2.5 billion in the first fiscal year for the National Advanced Packaging Manufacturing Program. IPC applauds both the Senate and the House for reaching an agreement and sending the bill to the President’s desk.” Click through here to read all the particulars and see the high-level numbers associated with CHIPS Plus. 

Q4 Concerns: Hold on to Your Hats 
Published August 3 

With our industry booming, even as we face inflation, rising interest rates, and a worker shortage so acute it might be slowing company growth, and a potential economic recession on the horizon, the signals are decidedly mixed. I-Connect007 talks with IPC Chief Economist Shawn DuBravac, looking ahead to the end of the year. DuBravac does his best crystal ball reading to tell us what to expect. 

Ventec Expands Flex-rigid Material Range for Critical Military, Aerospace, and Ultra-high Reliability Applications 
Published August 2 

The new materials from Ventec include a flex-rigid No Flow / Low Flow prepreg range – tec-speed 4.0 (VT-462(L) PP NF/LF), offering high-Tg, low Dk, low loss, and excellent thermal reliability, designed for military, aerospace/space, and other ultra-high reliability applications. Get a sense for the specification details here.  

New Book from I-Connect007 Examines Evolution of Electronics Industry NPI  
Published August 1 

In “The Electronics Industry’s Guide to…The Evolving PCB NPI Process,” Siemens topic experts Mark Laing and Jeremy Schitter offer a timely look at how the slowdown of production and delivery of materials and components in recent years has impacted the NPI process in the global marketplace. Check it out. 

MKS Instruments, Atotech Receive China Antitrust Clearance for Pending Acquisition of Atotech 
Published July 29 

Mergers and acquisitions continue. MKS Instruments and Atotech “have received unconditional merger approval from China’s State Administration for Market Regulation for MKS’ pending acquisition of Atotech. The transaction has now received all required regulatory clearances.” Now is the time for making acquisitions.

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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

12/02/2022 | Nolan Johnson, I-Connect007
Normally, the holiday season is a slow(ish) news time, but this year just feels different. My opinion is that the technology industry banked up a whole bunch of innovations and new products during the pandemic disruptions, which are coming to market as quickly as possible. The November/December news is full of technology discussion, as my selections this week clearly demonstrate.

3D Electronic Devices With Additive Manufacturing

11/29/2022 | Shavi Spinzi, Nano Dimension
Imagine fabricating PCBs without the hassle of drilled vias and metal plating. Imagine PCBs with near-perfect registration. If we take it to the next stage, imagine drawing electronics in 3D space. There is a way to do all this with additively manufactured electronics (AME). We just need to start to think in 3D. This will allow us to abandon the 2D limitations that we have become so used to and expand our horizons so that we can climb to higher levels of performance. In this article, I will explore the two fundamental capabilities that are the cornerstones for drawing electronics in 3D space, which is where AME technology and 3D design capabilities converge.

Electronica 2022: Happy to Be Back in Munich

11/21/2022 | Pete Starkey, I-Connect007
As we stepped out of the hotel into the drizzling rain, we were relieved that it wasn’t snow. Looking down the escalator into the U2 platform in Munich’s Hauptbahnhof central station early on the morning of Tuesday, Nov. 15 and observing the mass of humanity pushing and shoving to cram into trains to the exhibition centre, it appeared that a significant proportion of the international electronics industry had gathered to attend electronica 2022, co-located with SEMICON Europa and recognised as the world’s leading trade fair and conference for electronics.



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