MacDermid Alpha to Showcase Latest Circuit Board Assembly Innovations at Upcoming SMTA Expos

Reading time ( words)

MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will highlight its range of advanced solutions for circuit board assembly at the upcoming SMTA Queretaro Expo, Mexico on August 18, SMTA Ohio Expo, USA on August 24 and SMTA Chihuahua Expo on August 25.

MacDermid Alpha’s latest low temperature innovation, ALPHA OM-565 HRL3 solder paste, will be a highlight at all three SMTA Expos. The paste is designed to minimize warpage induced defects and enhance product reliability compared to existing low temperature solutions. At the SMTA Chihuahua Expo, Francisco Gallegos, Customer Technical Support Engineer – Mexico, will present a paper on this topic with  ‘Low Temperature Soldering: Traditional Sn-Bi alloys and Latest Developments in High Reliability Alloys for SMT and PTH Applications’.

Additionally, MacDermid Alpha will promote the ALPHA HiTech range of adhesives, underfills, edgebonds and encapsulants. These epoxy-based materials provide reinforcement and protection for soldered assembled components, enhancing reliability. Sustainability initiatives will also be a key focus, with emphasis on MacDermid Alpha’s Reclaim and Recycling Services. Offering safe and efficient recycling services, this service helps companies meet their environmental and legislative requirements, and at the same time, maximize the value of their waste streams. 

2022 is an important milestone for MacDermid Alpha with the business celebrating 250 years of combined innovation. The MacDermid brand is celebrating 100 years of supplying specialty chemical solutions for the most complex printed circuit board and IC substrate designs. The Alpha brand is celebrating 150 years of providing high performance component attachment materials for the electronics assembly industry. 

To learn more about MacDermid Alpha’s circuit board assembly solutions please visit:

Download The Printed Circuit Assembler’s Guide to… Low-Temperature Soldering by Morgana Ribas. You can also view other titles in our full I-007eBooks library. 



Suggested Items

Passing the Test With SMTA’s Rob Boguski

09/14/2022 | Andy Shaughnessy, I-Connect007
I recently spoke with Rob Boguski, president of Fremont, California-based Datest and an SMTA vice president and board member. Rob explained why today’s test customers are asking for more information than the traditional pass/fail, offers a preview of SMTA International, and gives an update on SMTA’s planning strategy for the next five years.

Four Silver Linings in the Stormy Clouds of Pandemic, Supply Chain, and Inflation

09/14/2022 | Dr. Ronald C. Lasky, Indium Corp.
It may be difficult to see any bright spots in the current and recent economic situation. We have all experienced the devastation of the pandemic, supply chain issues, and most recently, inflation. However, as a senior technologist for an international materials supplier (Indium Corporation) and a professor of engineering at an Ivy League research university (Dartmouth College), I offer these four silver linings for those of us in the electronics industry.

Solder Paste Printing and Optimizations for Interconnecting Back Contact Cells

07/26/2022 | Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.

Copyright © 2022 I-Connect007. All rights reserved.