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New Integrated Solder Paste Print Part System from PDR Rework Systems
August 18, 2022 | PDR Rework SystemsEstimated reading time: 1 minute
PDR, a leading manufacturer of BGA rework systems, test and X-ray inspection systems since 1985, is pleased to introduce its new Integrated Solder Past Print Part System for rework. The tools are designed to work with all PDR Evolution Series Rework Systems.
Treated with high durability Carbon Nanotube Technology for superior paste-to-component release, PDR’s Print Part System offers superior paste printing to component results with minimal effort.
Key to the success of any print part operation is the ability of the print part fixture to supply correct and equal pressure to the component when undergoing the pasting operation. PDR’s exclusive design offers a hands-free/tool-free calibrated pressure nest to ensure constant and direct pressure is achieved, thus providing superior paste application and deposition, virtually eliminating the need for re-prints.
The PDR Print Part System mounts directly to all PDR Evolution Series Rework platforms for direct vertical lift utilizing PDR’s Integrated Vacuum Pick Up Feature/Gram Force placement settings. Designed for integration into your rework process when using PDR Systems, the PDR Print Part System also can be used as a stand-alone device for general printing of solder paste to component.
PDR’s Print Part System is made of high quality materials and manufactured with new, state-of-the-art laser technology to ensure highly accurate stencil fabrication and ultra-smooth edge/bore finishes.
Suggested Items
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.