IPC Issues Call for Participation: Help Shape the Future of Design for Environment Standards

Reading time ( words)

IPC’s Design for Excellence (DFX) guidelines document, IPC-2231 provides a framework to establish a design review process for the layout of printed board assemblies. This design review assesses the manufacturability attributes of printed boards, namely design for manufacturing, fabrication, assembly, testability, cost, reliability, environment, and reusability. IPC is aware of the responsibilities that electronics manufacturing companies will soon have to regulatory bodies around the world as well to the environment.

IPC’s 1-14 DFX Committee is actively reviewing IPC-2231A in order to revise it within the next two years. While a revision of the DFX guidelines document is IPC’s and the standards committee’s first priority, the team anticipates that they may be able to expand IPC eco-design activities to include the creation of a new eco-design for electronics guideline that provides a holistic coverage of circularity concepts and how they touch every step of the electronics manufacturing pipeline.

“We feel that this is an excellent opportunity to make a real difference in eco-design for circular electronics – but it all starts with the IPC-2231 DFX guidelines document,” said Patrick Crawford, IPC manager for design standards and related industry programs and IPC staff liaison to the 1-14 DFX Committee. “While IPC is determined to help electronics manufacturing companies become greener themselves, it will take continued input from industry through standards development activities through organizations like IPC, to produce meaningful change.”

Experts in green PCB design techniques, materials, manufacturing technologies, sourcing, policy, and regulation are invited to create the next standard for design for environment. If you have expertise or passion to create a greener future that benefits both industry and environment and want to contribute to establishing a best practice design methodology, please reach out to Patrick Crawford at PatrickCrawford@ipc.org.


Suggested Items

Managing Footprints With Integrated EDA Tools

02/23/2021 | Matt Walsh, Siemens Digital Industries Software
Electronics companies are always under great pressure to continually grow and innovate. In addition to navigating ever-accelerating design cycles, they must also address and overcome generational complexities associated with their products, the underlying components they use, and the human capital accountable for delivering on time and on budget. Electronics firms can ill afford the time and resource inefficiencies associated with manually correcting design errors, poor library data integrity, or other inconsistencies leading to missed deadlines or even costly re-spins.

We Are Stronger by What Unites Us

02/11/2021 | Stephen V. Chavez, PCEA, and Tanya Martin, SMTA
PCEA President Stephen V. Chavez and SMTA Global Executive Director Tanya Martin co-wrote this letter to the editor in response to a recent PCB007 column.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

01/15/2021 | Andy Shaughnessy, Design007 Magazine
Hard to believe that a year ago, I was getting ready to attend DesignCon and IPC APEX EXPO and wondering if this Novel Coronavirus was going to cut into attendance from the Pacific Rim. Now, we’re accustomed to virtual trade shows. They’re not ideal, but they’re the best we can do while meeting in person is not possible. We’ve learned to adapt.

Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.