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PDR, a leading manufacturer of BGA rework systems, test and X-ray inspection systems since 1985, announced the release of the firm’s new integrated Reballing system for all PDR Evolution Series Rework Systems.
PDR’s latest reball system now incorporates both solder paste application and reball sphere attach in one easy-to-use system, incorporating advanced nano-technology for a clean, high precision reball method for rework.
This PDR exclusive also incorporates a conveniently integrated excess sphere recovery chamber to capture excess spheres that can easily be accessed on the reball platform for later use, or to accelerate the process when re-balling multiple BGA’s concurrently.
When used with PDR’s ThermoActive Suite Software Reballing Mode profiles, the entire process is simple to use, accurate and provides quality reballing results. This saves both time and money, as well as preventing solder sphere loss due to handling errors.
Although made specifically to integrate into PDR Systems, PDR Reball systems can be used as stand-alone devices for any reballing application where highly accurate reball applications are required.
PDR Reball System are made of high-quality materials and are manufactured with new, state-of-the-art laser technology to ensure highly accurate stencil fabrication and ultra-smooth edge/bore finishes.
Andy Shaughnessy, I-Connect007
I recently spoke with Rob Boguski, president of Fremont, California-based Datest and an SMTA vice president and board member. Rob explained why today’s test customers are asking for more information than the traditional pass/fail, offers a preview of SMTA International, and gives an update on SMTA’s planning strategy for the next five years.
Dr. Ronald C. Lasky, Indium Corp.
It may be difficult to see any bright spots in the current and recent economic situation. We have all experienced the devastation of the pandemic, supply chain issues, and most recently, inflation. However, as a senior technologist for an international materials supplier (Indium Corporation) and a professor of engineering at an Ivy League research university (Dartmouth College), I offer these four silver linings for those of us in the electronics industry.
Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.