Indium Experts to Present at SMTA International


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Three Indium Corporation experts will share their industry knowledge and expertise during four presentations at SMTA International from Oct. 31-Nov. 3 in Minneapolis, Minn.

The following technical presentations will be featured:

  • Novel Lead-Free Solder Alloys Based on Sn-Ag-Cu-Sb with Enhanced Thermal and Electrical Reliability by Dr. Jie Geng, research metallurgist
  • Implementing the D-Value to Supplement the P-Value in Electronic Assembly by Dr. Ron Lasky, senior technologist
  • A Novel Lead-Free Lower-Temperature Solder Paste for Wafer-Level Package Application by Dr. HongWen Zhang, R&D manager, alloy group
  • A Drop-in High-Temperature Lead-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete Applications by Zhang

Dr. Geng is a research metallurgist in the Research & Development (R&D) Department at Indium Corporation. In his role, he focuses on the development of novel lead-free, high-reliability solder alloys for automotive applications. He also investigates the assembly process technologies in electronic packaging and interconnections. He received his Ph.D. in metallurgy from University of Surrey in the United Kingdom. He has extensive experience in materials selection, design, processing, and characterization. Dr. Geng is skilled in combinatorial and high-throughput material design using 3D printing and computer programming with Python. He has had more than 30 journal articles published. He is also a Certified SMT Process Engineer.

Dr. Lasky is a senior technologist at Indium Corporation, as well as a professor of engineering and the director of the Lean Six Sigma program at Dartmouth College in Hanover, N.H., U.S. He has more than 30 years of experience in electronics and optoelectronics packaging at IBM, Universal Instruments, and Cookson Electronics. Dr. Lasky has authored six books, and contributed to nine more, on science, electronics, and optoelectronics, and has authored numerous technical papers. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering, and science and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products related to cost estimating, line balancing, and process optimization. He is the co-creator of Surface Mount Technology Association’s (SMTA) SMT Process Engineering Certification program and exams that set standards in the electronics assembly industry worldwide. Dr. Lasky was awarded the Surface Mount Technology Association’s (SMTA) Technical Distinction Award in 2021 for his “significant and continuing technical contributions to the SMTA.” He was also awarded SMTA’s prestigious Founder’s Award in 2003.

Dr. Zhang is manager of the alloy group in Indium Corporation’s R&D department. His focus is on the development of Pb-free solder materials and the associated technologies for high-temperature and high-reliability applications. He was instrumental in inventing the mixed-alloy solder technique to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding surface, and control the joint’s morphology, thus improving reliability. Dr. Zhang has a bachelor’s degree in metallurgical physical chemistry from Central South University of China, a master’s degree in materials and engineering from the Institute of Metal Research, Chinese Academy of Science, and a master’s degree in mechanical engineering and a Ph.D. in material science and engineering from the Michigan Technological University. He has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is a certified IPC Specialist for IPC-A-600 and IPC-A-610 as well as a certified SMT Process Engineer. He has extensive experience in various aluminum (Al) alloys and fiber/particle reinforced Al-based composite materials, and Al-rich and ZrHf-based amorphous alloys. He has co-authored two book chapters on high-temperature lead-free bonding materials, has had a number of patents filed, and has been published in approximately 20 journals in the fields of metallurgy, materials science and engineering, physics, electronics materials, and mechanics.

Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007eBooks library. 

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