MacDermid Alpha Exhibits Capabilities and Latest Technology at Semicon Taiwan


Reading time ( words)

MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Semiconductor and Assembly Solutions that provides unmatched capabilities in electronics design and manufacturing, will exhibit its total process solutions for the emerging semiconductor market at Semicon Taiwan, Taipei City, September 14-16, 2022 at Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1).

Featured will be the entire portfolio of technologies from the Alpha, Compugraphics, Electrolube, Kester and MacDermid Enthone brands that enable end device designers and manufacturers to meet the evolving and demanding needs of the semiconductor industry.

“Increasing component density, finer pitch and thermal management are critical to advanced package technology evolution.” explains Marc Lin, Taiwan Sales Director at MacDermid Alpha. “Our broad offerings from wafer level plating, packaging and assembly technologies bring unique solutions to support our customers. Our mission is to advance their process/device capability and reliability. “

Clare Wang & Tim Guo, Technical Lead & Technical Engineer, MacDermid Alpha Power Semiconductor & Discrete Packages team will present at the ‘TechXPOT’ section on ‘Enabling Efficient 5G Device Packaging with Novel Hybrid Silver Sintering Die Attach Technology’.  Wang and Guo will discuss the significant increase in demand for high thermal attach materials in 5G infrastructure and communication devices. To meet this demand, MacDermid Alpha has developed a novel silver sintering die attach technology – ATROX 800HT series. ATROX 800HT series provides extremely high electrical and thermal conductivity, increased reliability, and enables drop-in compatibility for high volume manufacturing (HVM) of high power 5G devices.

Share




Suggested Items

Four Silver Linings in the Stormy Clouds of Pandemic, Supply Chain, and Inflation

09/14/2022 | Dr. Ronald C. Lasky, Indium Corp.
It may be difficult to see any bright spots in the current and recent economic situation. We have all experienced the devastation of the pandemic, supply chain issues, and most recently, inflation. However, as a senior technologist for an international materials supplier (Indium Corporation) and a professor of engineering at an Ivy League research university (Dartmouth College), I offer these four silver linings for those of us in the electronics industry.

Thriving Through Greater EMS Collaboration

08/23/2022 | Chris Peters, USPAE
Events of the past two years have clearly demonstrated the value of strong trading relationships. When materials become constrained, as in the recent microchip shortage or any of the pandemic-driven supply chain snafus, the companies that have those materials have a choice to make. Which customers will be put at the front of the line, and which will be placed at the rear? Too often, company executives assume that since they are a large buyer, they automatically will be prioritized when supplies are constrained. Research has shown that this is not always the case, and that assumption can leave a company in a weakened position.

New Book from I-Connect007 Examines Evolution of Electronics Industry NPI

08/01/2022 | I-Connect007
The Electronics Industry’s Guide to… The Evolving PCB NPI Process is the first book in I-Connect007’s new The Electronics Industry’s Guide to… technical series. This valuable resource is for all segments of the electronics interconnect industry.



Copyright © 2022 I-Connect007. All rights reserved.