MacDermid Alpha Exhibits Capabilities and Latest Technology at Semicon Taiwan

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MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Semiconductor and Assembly Solutions that provides unmatched capabilities in electronics design and manufacturing, will exhibit its total process solutions for the emerging semiconductor market at Semicon Taiwan, Taipei City, September 14-16, 2022 at Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1).

Featured will be the entire portfolio of technologies from the Alpha, Compugraphics, Electrolube, Kester and MacDermid Enthone brands that enable end device designers and manufacturers to meet the evolving and demanding needs of the semiconductor industry.

“Increasing component density, finer pitch and thermal management are critical to advanced package technology evolution.” explains Marc Lin, Taiwan Sales Director at MacDermid Alpha. “Our broad offerings from wafer level plating, packaging and assembly technologies bring unique solutions to support our customers. Our mission is to advance their process/device capability and reliability. “

Clare Wang & Tim Guo, Technical Lead & Technical Engineer, MacDermid Alpha Power Semiconductor & Discrete Packages team will present at the ‘TechXPOT’ section on ‘Enabling Efficient 5G Device Packaging with Novel Hybrid Silver Sintering Die Attach Technology’.  Wang and Guo will discuss the significant increase in demand for high thermal attach materials in 5G infrastructure and communication devices. To meet this demand, MacDermid Alpha has developed a novel silver sintering die attach technology – ATROX 800HT series. ATROX 800HT series provides extremely high electrical and thermal conductivity, increased reliability, and enables drop-in compatibility for high volume manufacturing (HVM) of high power 5G devices.


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