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IPC Training Course on PCB Design for HDI and Advanced Packaging
September 15, 2022 | IPCEstimated reading time: Less than a minute
IPC will be holding an online training course on printed circuit board (PCB) design for HDI and advanced packaging. This course will provide the skills necessary to create PWB/PBA designs that require advanced or complex packaging—including boards with limited board area that must comply with IPC standards and require non-orthogonal placement and routing; non-standard board outline geometry; non-standard board mounting; and advanced board materials.
Taught by an IPC-certified industry expert, the six-week program—to be held from October 27 to November 23 (every Mondays and Wednesdays at 11:00 am to 1:00 pm)—utilizes interactive webinars, on-demand recorded class sessions, job-specific exercises, and team projects to facilitate mastery of the key concepts required by circuit board designers.
This course is ideal for individuals who need further experience with packaging and routing challenges involved with modern high density, reduced board area, and complex geometry designs.
Upon completion, participants will be able to compress circuit topology while maintaining circuit performance; understand the trade-off of advanced PCB materials; define a board stackup that take implements micro-vias; define and implement non-standard (non-orthogonal) parts placement and routing; and define non-standard PCB mechanical retention and keep-outs.
For more information or to register, click here.
Suggested Items
PCBflow Helps Designers Choose Best Manufacturer for the Job
03/28/2024 | Andy Shaughnessy, Design007 MagazineI recently spoke with a few technologists who have first-hand experience with PCBflow: Susan Kayesar, technical product manager with Siemens; Evgeny Makhline, CTO of Nistec, a CEM based in Israel; and Peter Tranitz, senior director of technology solutions and leader of the IPC Design Initiative. They explain how PCBflow functions, from the designer’s and manufacturer’s viewpoint, and how this database helps break down the wall between these stakeholders.
ASMPT to Exhibit Smart Manufacturing at IPC APEX EXPO 2024
03/27/2024 | ASMPTWith its innovative, data-driven Intelligent Factory concept and a comprehensive hardware and software portfolio around SMT production, market and innovation leader ASMPT will be a major presence at the IPC APEX EXPO 2024, the industry’s main event in California.
Mycronic to Showcase More Versatile, High-productivity Assembly Solutions at IPC APEX EXPO 2024
03/27/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect PCB assembly at IPC APEX EXPO 2024 in Anaheim, CA on April 9 - 11.
TRI Launches New Advanced Packaging 3D CT AXI Solution
03/26/2024 | TRITest Research, Inc. (TRI) proudly announces the launch of the SEMI 3D CT AXI solution, TR7600F3D SII Plus, marking a paradigm shift in precision and reliability for high-reliability electronics manufacturing, such as the Advanced Packaging Industry.
Blackfox Ready for IPC APEX EXPO 2024
03/26/2024 | Andy Shaughnessy, I-Connect007Blackfox Training Institute offers IPC-certified training for a myriad of PCB assembly techniques and standard certifications. With many technologists beginning to eye retirement, this training is at a premium. I recently spoke with Jamie Noland, director of training and education for Blackfox, about the company’s latest educational efforts, and his plans for the upcoming IPC APEX EXPO, where Blackfox will be exhibiting.