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ZESTRON, a leading global provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that their Latin American sales team will be attending, presenting, and featuring our newest product, ATRON® DC, at SMTA Guadalajara Expo & Tech Forum.
Andres Turrubiates, Latin America Applications Engineer for ZESTRON Americas, is an active member of the SMTA as well as IPC. Mr. Turrubiates is responsible for providing technical support to our customers in Mexico & Latin America, including cleaning process recommendations and onsite customer support for process implementations and optimizations. During the SMTA Guadalajara Expo, Mr. Turrubiates will present “Cleaning of Electronics Assemblies in Limited Spaces & Low Standoff Components” on Wednesday, September 21st, at 12:00 PM. The presentation will discuss challenges, cleaning methodology, findings, and advantages of using cleaning agents over DI Water.
At the show, ZESTRON will promote our new maintenance cleaner, ATRON® DC. The cleaning agent was designed to remove the conformal coating from pallets, fixtures, and tools. It quickly and reliably removes different coating materials, including acrylics, urethanes, and epoxies, without the need for labor-intensive manual cleaning.
Andy Shaughnessy, I-Connect007
In this interview, KYZEN Executive Vice President Tom Forsythe explains his company’s plans for the upcoming SMTA International show in Minneapolis, Minnesota, Oct. 31-Nov. 3. He discusses KYZEN’s latest aqueous cleaning chemistries and the company’s focus on providing reliable cleaning equipment and accurate data for customers. "This is the latest in that expanded envelope, with better economics, and better environmental health and safety," he says. "It's all part of this trend of always trying to be a better product and deliver better value.
Mark Laing, Siemens Digital Industries Software
New product introductions (NPIs) and customization have been increasing rapidly over the past few years—with the results that the already-small profit margins in electronics assembly are shrinking even further. Fifteen years ago, the PCB was the product. Today, most products are a system, with multiple PCBs, cables, and enclosures. Many manufacturers want to provide turn-key products that have multiple BOMs, making the assembly process even more complicated.
Patty Goldman, I-Connect007
Doug Pauls holds a B.A. in chemistry and physics from Carthage College, Kenosha, Wisconsin, and a B.S. in electrical engineering from the University of Wisconsin, Madison. He worked nine years for the Navy, eight years as technical director of Contamination Studies Labs, and 19 years at Rockwell Collins (now Collins Aerospace), in the Advanced Operations Engineering group, where he is a principal materials and process engineer. Doug was awarded the Rockwell Collins Arthur A. Collins Engineer of the Year Award in 2004.