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BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced the appointment of Smd-Tec as its new exclusive distributor for reflow soldering systems in the Benelux region.
Smd-Tec will provide sales, technical and after sales support for BTU’s high-performance reflow ovens and custom furnaces. Since 1950, BTU has been the partner of choice for manufacturers facing the most complex thermal processing challenges.
“We are excited and honored to team up with BTU,” says Tom Van Tongelen, CEO at Smd-Tec. “Their high reliability and energy efficient solutions are a perfect match for our customers in the Benelux region that can now benefit from a broad range of reflow systems to fit every need.”
Oliver Wehner, European Sales Manager, BTU, stated: “We are very pleased to begin our collaboration with SMD/Tec. Their existing partnerships provide a great opportunity to access the Benelux market with a high-quality line of equipment. SMD/Tec will be able to provide technical support and sales after care for our existing installed base and new installations.”
Established in 2009, Smd-Tec is passionate about solutions for achieving efficient electronics production in the Benelux countries.
Andy Shaughnessy, I-Connect007
I recently spoke with Leo Lambert, vice president of technology for EPTAC, about the training company’s newest classes and his plans for the upcoming SMTA International. The event, co-located with the Medical Device & Manufacturing (MD&M) Show, takes place in Minneapolis Oct. 31—Nov. 3. It’s never a dull moment in this industry and Leo takes a few minutes to talk about his company’s certification efforts, what’s planned for SMTAI, and where some of this technology is headed. Swallowing a pill that measures diagnostics? It’s a great time to be in the industry.
Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.
I-Connect007 Editorial Team
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.