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Indium Corporation is pleased to announce that Nate Discavage has joined the company as a talent acquisition supervisor.
In this role, Discavage is responsible for developing improvements for recruiting and attracting top talent, engaging in strategic community outreach activities to develop contact with groups and organizations. He also manages Indium Corporation’s award-winning internship program, and implements diversity recruiting strategies consistent with Indium Corporation’s affirmative action plan and objectives.
Prior to joining Indium Corporation, Discavage was a recruiter at the Resource Center for Independent Living (RCIL). During his time with RCIL, he helped rebuild their recruitment approach, adding structure and processes to streamline the hiring timeline and ensure a positive candidate experience.
Nate earned a bachelor’s degree in journalism and mass communications from St. Bonaventure University. He currently serves on the City of Utica’s Access & Inclusion Committee.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007eBooks library.
Real Time with...SMTAI
Brian O’Leary, head of Indium's e-Mobility & Infrastructure, reacts to SMTAI’s keynote delivered by John Thomas of Autel. The title of the keynote presentation was "The Electronic Vehicle (EV) Conundrum" which addressed the sheer scale of the transition to e-Mobility that we are now undertaking. In this interview, O’Leary discusses some of the technical challenges faced in product development by Indium (and everyone else) as well as the new IPC e-Mobility council. Participation in the council is open to everyone.
Dr. Ronald C. Lasky, Indium Corp.
It may be difficult to see any bright spots in the current and recent economic situation. We have all experienced the devastation of the pandemic, supply chain issues, and most recently, inflation. However, as a senior technologist for an international materials supplier (Indium Corporation) and a professor of engineering at an Ivy League research university (Dartmouth College), I offer these four silver linings for those of us in the electronics industry.
I-Connect007 Editorial Team
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.