MacDermid Alpha to Present Next Generation Assembly at TechBlick 2022


Reading time ( words)

MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will present the technical paper ‘Next Generation Assembly and Interconnect Technologies for Smart Structures and Functional Surfaces’ at the TechBlick Conference and Expo taking place October 12-13 in Eindhoven, Netherlands.

Rahul Raut, Global Portfolio Manager – FFPE at MacDermid Alpha, will discuss the key building blocks of 3D smart structural platforms, covering novel film substrates which include multifunctional PC substrates for In-Mold Electronics, highly conductive and formable Silver Inks, high performance formable Dielectrics, formable structural and electrically conducting adhesives (ECAs) and formable encapsulants. The performance and capability of integrated multi-layer stacks that can be thermoformed and then injection molded to produce smart, interactive 3D structures will be presented, as well as the ability of these integrated 3D structures to meet or exceed the stringent reliability requirements for automotive, medical, white goods and other demanding applications.

MacDermid Alpha’s suite of electronic inks, coatings and film materials are designed to meet the unique functional and reliability requirements for In-Mold Electronics, Functional HMI (Human-Machine Interface) Surfaces and Adhesively Laminated FPCs. We offer a comprehensive suite of fully compatible materials, processing and applications support for our films, electronic inks & adhesives to produce 3D Smart, Functional and 3D Automotive HMI Structures. Our film capabilities include functional and decorative solutions, such as heat-stabilized Autostat PET and XtraForm PC films. Additionally, our electronic materials portfolio provides integrated electronics capabilities for the printed circuit board and semiconductor industries. We provide an inter-compatible comprehensive solution of electronic materials, films and processes.

Rahul Raut will present the technical paper on Wednesday 12th October at 3.20pm during the TechBlick Conference. MacDermid Alpha will also participate in the TechBlick expo, visit us at tabletop number 38 to discuss our latest technologies for 3D In-Mold Electronics. To register for TechBlick's website.

Share




Suggested Items

Material Management and Control

11/21/2022 | Davina McDonnell, Cogiscan
In a market that is trying to catch up with increasing customer demands and quickly ship products out the back door, no electronics manufacturing plant can afford to lose any time or resources during the production process. Manufacturers are forced to do more with less and get the most out of every single precious component.

Modern Inventory Management Secrets

11/07/2022 | Michael Ford, Aegis Software Corp.
Inventory management should be simple; after all, it is how many of us learned to count. ERP solutions have become complex yet cannot solve our immediate supply-chain and manufacturing challenges unaided. It’s time to unfold the root-causes behind key issues and reveal the secrets for success in modern inventory management which have a significant impact on any manufacturing business.

Axiom Inspired by Industry Challenges

09/20/2022 | Michael Schindele, Axiom
After living through more than two years of the pandemic, we are very aware of the issues facing the electronics industry. We have witnessed months of factory shutdowns, labor disruptions due to a reduced workforce, and country, regional, and citywide COVID regulations and shutdowns. I will describe some of the issues we’ve been facing, and then explain how we learned to be creative and look for the silver linings in these disruptions.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.