Yield Engineering Systems Partners with Benchmark for Global Engineering and Manufacturing Support


Reading time ( words)

Benchmark Electronics, Inc., a global provider of engineering, design, and manufacturing services, announced it is partnering with Yield Engineering Systems (YES) to transfer the manufacturing of the YES flagship product line to its facility in Malaysia, as well as providing engineering and manufacturing support for YES's upcoming innovative modular wet process systems in the Phoenix, Arizona area.

"We have developed a strong partnership with Benchmark built on trust and our combined expertise," said Ramakanth Alapati, Chief Executive Officer of YES. "We look forward to working closely with the team to bring our technology to a wider market, and to further expanding our footprint in the semiconductor capital equipment industry as the need for semiconductor manufacturing support continues to grow worldwide."

YES is at the leading edge of material modification and surface enhancement solutions. The company's patented technologies significantly enhance the speed, reliability, and cost-effectiveness of semiconductor production processes. YES's thermal, deposition, and wet process systems provide critical technology to semiconductor, life science, and display manufacturers large and small as they work to meet the demand for semiconductors, genomics, point of care diagnostics, and innovative displays.

Benchmark's Phoenix operation will be leveraging the company's deep expertise in the semiconductor capital equipment market, including mechatronic engineering, precision machining, and sub-system assembly. The partnership comes at a critical time as the CHIPS Act has created a flurry of activity around the semiconductor industry and demand for organizations supporting the industry has risen dramatically.

"YES is helping solve critical problems for their customers  in the fast-growing semiconductor manufacturing industry," said Jeff Benck, president and CEO, Benchmark. "We're proud to be selected as their strategic partner and look forward to working hand-in-hand with their team to help bring their technology to market to meet the demand for semiconductor capital equipment."

Share




Suggested Items

Real Time with... SMTAI 2022: Essemtec Claiming Its Place in the Automated Factory

11/09/2022 | Real Time with...SMTAI
Bryce Timms, managing director, gives Nolan Johnson a tutorial on Essemtec’s position in the market, how Essemtec (as a division of Nano Dimension) fits not only into the additive manufacturing space but also in the more traditional EMS market.

Advanced Packaging Gets an Additive Upgrade

11/08/2022 | Art Wall, NextFlex
The recent approval of the CHIPS Act has reignited the U.S. semiconductor industry and shone a spotlight on the intricacies involved in chip manufacturing. As new technological innovations—such as 5G, IoT, AI, automotive and high-performance computing—come to market, they’re pushing chip manufacturing and integration capabilities. They demand more performance which leads to added complexity in an already extremely complicated process. All this requires a fundamental shift in the way that semiconductors are manufactured and integrated.

SMTAI: Packed With Content!

10/10/2022 | Andy Shaughnessy, I-Connect007
We’re now in trade show season, and SMTA International is coming up at the end of this month, so I asked SMTA President Martin Anselm to discuss the show and what manufacturing professionals should expect to take away from this event, now in its second year at the Minneapolis Convention Center.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.