INDIEV, Foxconn Sign MOU to Produce Prototype INDI One in Ohio


Reading time ( words)

INDIEV, Inc. and Hon Hai Technology Group (Foxconn) announced the signing of a Memorandum of Understanding (MOU), paving the way for Foxconn Ohio to manufacture the first INDI One prototype vehicles.

Regarding the partnership, INDIEV founder and CEO Shi Hai said, “The INDI One is a unique vehicle in that it demands the highest quality of automotive craftsmanship as well as consumer electronics manufacturing and engineering. Partnering with Foxconn, the world’s leader in consumer electronics, during this exciting time in their entry into electric vehicles means that INDI One drivers will lead the way into the future of personal transit.”

“Our MOU with INDIEV marks the beginning of many more discussions to come regarding the future of EV manufacturing in Ohio. Throughout this process, Foxconn is confident in its Ohio workforce to manufacture quality prototypes that will help INDIEV achieve future success,” said Foxconn Chief Product Officer Jerry Hsiao. Details of the potential collaboration, beyond the prototype build, will be disclosed at a later date as both sides remain in negotiation.

Foxconn assumed manufacturing operations at its Ohio facility after completing an Asset Purchase Agreement (APA) with Lordstown Motors Corp. in May 2022. At present, the electric pickup truck production line in the facility has entered mass production, and the tractor vehicle production line is expected to begin in the first quarter of 2023. This MOU is the newest electric vehicles manufacturing opportunity confirmed for Foxconn following the closing of the APA, with the binding provision to build the INDI One prototype vehicles at Foxconn Ohio. This MOU also serves as first steps towards delivering vehicles to customers for INDIEV, who began development of the INDI One in 2017, and revealed the vehicle publicly in October of 2021.

Share




Suggested Items

Real Time with... SMTAI 2022: Essemtec Claiming Its Place in the Automated Factory

11/09/2022 | Real Time with...SMTAI
Bryce Timms, managing director, gives Nolan Johnson a tutorial on Essemtec’s position in the market, how Essemtec (as a division of Nano Dimension) fits not only into the additive manufacturing space but also in the more traditional EMS market.

Advanced Packaging Gets an Additive Upgrade

11/08/2022 | Art Wall, NextFlex
The recent approval of the CHIPS Act has reignited the U.S. semiconductor industry and shone a spotlight on the intricacies involved in chip manufacturing. As new technological innovations—such as 5G, IoT, AI, automotive and high-performance computing—come to market, they’re pushing chip manufacturing and integration capabilities. They demand more performance which leads to added complexity in an already extremely complicated process. All this requires a fundamental shift in the way that semiconductors are manufactured and integrated.

SMTAI: Packed With Content!

10/10/2022 | Andy Shaughnessy, I-Connect007
We’re now in trade show season, and SMTA International is coming up at the end of this month, so I asked SMTA President Martin Anselm to discuss the show and what manufacturing professionals should expect to take away from this event, now in its second year at the Minneapolis Convention Center.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.