SMTA International Technical Conference: Trending on Topic

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One of the highlights of SMTA International is the Technical Conference, where more than 100 papers will be presented across at least 30 sessions.

“Work that was delayed due to the effects of COVID has been completed and the amount of material coming from the industry is impressive,” says Julie Silk, VP of technical programs. “We have a packed conference this year in Minneapolis.”

The Technical Conference is part of SMTA International, scheduled for Oct. 31 to Nov. 3, at the Minneapolis Convention Center in Minneapolis, Minnesota. To attend the conference sessions, registration is required.

The Technical Conference is organized and managed by Silk, who works for Keysight Technologies, and Raiyo Aspandiar of Intel Corporation and SMTAI conference chair.

They are assisted by the SMTA International Technical Advisory Committee (TAC), which is comprised of distinguished electronics manufacturing and packaging industry experts. They designed the conference to ensure that the latest trends and developments are fully addressed.

The Technical Conference has nine technical tracks:

  1. Advanced Packaging (APT)
  2. High Performance and Reliability (HPR)
  3. Interconnect Research and Reliability (IRR)
  4. Low Temperature Solder (LTS)
  5. Manufacturing Excellence (MFX)
  6. Materials for Electronics (MAT)
  7. Medical & Defense Symposium (MD)
  8. Technical Innovations (TI)
  9. Test and Inspection (INS)

Silk says some of the tracks have been renamed from previous years to better describe the content for these sessions. For example, High Performance and Reliability (HPR) “covers the unique requirements in industries such as automotive and space,” she says. “M&D covers papers on substrates, PCB fabrication chemistries, adhesives, solders, and more.”

The Interconnect Reliability and Research (IRR) Symposium has outstanding content that will help attendees understand the mechanisms that drive failure.

The following track names have remained the same:

  • Advanced Packaging Technology: Includes new research completed since the very popular Wafer Level Packaging Symposium in the spring
  • Inspection and Test (INS): Highlights useful testing
  • Technical Innovations: Covers machine learning, digital factory, and unique processes

There were so many papers in the Manufacturing Excellence (MFX) and Low Temperature Solder (LTS) tracks that there are several sessions for each.

Originally published in the October 2022 issue of SMT007 Magazine, click to continue reading this article.


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