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Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase its award-winning inspection solutions at electronica on 15-17 November 2022 in Munich, Germany. We will present our innovative technologies to a global audience at this leading tradeshow in booth A3.358.
Additionally, Koh Young is sponsoring the Advanced Packaging Conference, which event organizers are holding in conjunction with electronica. This technical conference is an important forum for discussing the latest developments in packaging technology. We look forward to meeting you at electronica 2022 and sharing our latest innovations with you.
If you are looking for the latest in conformal coating inspection technology, you will want to check out Neptune C+ and the Neptune T at our booth. Our award-winning technology is sure to be one of the company's highlights.
Most optical systems use UV light to inspect the surface for presence and gauges to measure material thickness in a particular spot, which does not provide the accuracy and repeatability needed. Inspecting transparent materials proved to be a challenge for traditional laser-confocal or electron microscope systems that only measure three-dimensional shapes. Koh Young’s revolutionary Neptune C+ delivers the ultimate solution to these challenges.
The Neptune T is the world's first 3D optical measurement instrument for transparent materials. It is available for coating, underfill, epoxy, glue, and bonding material inspection. With its patented L.I.F.T. technology, the Neptune T provides accurate thickness measurement of even the most transparent materials. The system allows manufacturers to explore depths of its process and accurately identify defects with 2D, 3D, and cross-section views.
Koh Young offers a full range of inspection solutions for advanced packaging and mini- and micro-LED applications. You can learn more about these innovative systems and our multiple industry awards by visiting our booth A3.358.
The Meister D is a perfect solution for production-speed 3D inspection of die and small MLCCs using an integrated measurement tool with defect analysis software based on advanced optics and AI engines. The system inspects micro cracks, chips, foreign material, and more.
The Meister S has been qualified for mass production by major semiconductor foundries and Mini/Micro-LED companies for micro solder inspection with superior full 3D inspection performance. Combining innovative vision algorithms and high-resolution optics, the Meister S goes beyond micro solder paste inspection, but also a proven solution for Flux inspection.
Additionally, we will present our flagship AOI (Zenith 2) and SPI (aSPIre 3) to show attendees. We offer the opportunity to discover the industry´s best performing True 3D inspection solutions.
The AOI sets new standards with novel SMT process management tools by combining advanced vision algorithms with innovative high-resolution optics, allowing a wider inspection coverage including advanced tall component inspection. The Zenith 2 delivers clear and concise AOI measurement to accurately identify multiple defects such as missing solder, offset, polarity, upside down, OCV/OCR, solder fillet, billboarding, lifted lead, lifted body, tombstone, bridging, and more.
The SPI delivers the highest standard in the metrology-level True 3D SPI market, ensuring incomparable performance for the most demanding applications. The inspection system uses our AI platform for print process optimization with the award-winning Koh Young Process Optimizer (KPO).
Additional content from Koh Young:
- The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal
- “Converting Process Data Into Intelligence” by Joel Scutchfield and Ivan Aduna, a free 12-part micro webinar series
- You can also view other titles in our full I-007eBooks library.