I-Connect007 Editor’s Choice: Five Must-Reads for the Week


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Where did the year go? I can’t believe we’re planning our January and February issues now. It was 84 degrees most of last week in Atlanta, and now it’s 31. I guess I should take my Hawaiian shirts out of rotation!

This week we have quite a variety of articles for you. It’s officially show time and the industry is back in business in a major way. We have some news coming out of last week’s advanced packaging event in Washington, D.C., and an article about navigating SMTA International, which opens on Halloween this year in Minneapolis. 

We have a great column on avoiding EMI with good routing strategies, and an article on electrically conductive inks. To top it off, I-Connect007 has published a new book, written by Matt Stevenson of Sunstone Circuits, that posits a new “design for”: Designing for Reality. If you’re a designer, isn’t designing for reality what it’s all about? 

See you next time.

Sunstone and I-007eBooks Launch Book on Designing for Reality 
Published October 20

There are probably a dozen “design fors” floating around now, with DFM being ubiquitous at this point. But this new I-Connect007 book cuts right to the chase with a new acronym: The Printed Circuit Designer’s Guide to… Designing for Reality. Sunstone’s Matt Stevenson takes designers through the reality of the PCB fab process. Matt basically says, “Here’s what works, and here’s what doesn’t. Let’s go.” Check it out.  

IPC Symposium: U.S. Must Address Critical Gaps in Advanced Packaging Needs 
Published October 12

As fictional NASCAR driver Ricky Bobby so eloquently put it, “If you ain’t first, you’re last.” When it comes to advanced substrate packaging, North America is definitely not in first place. As Jan Vardaman explains, last week’s IPC Advanced Packaging Symposium in Washington, D.C., represented a call to action. Speakers from across the electronics industry and various branches of the U.S. government addressed this gap in the supply chain which threatens our ability to develop the most cutting-edge fighter planes and weaponry. We’ll keep a watch on this situation.

Time to Go ‘Exploring’ at SMTA International 
Published October 19

If you’re getting ready for SMTA International, don’t miss this. Editor Michelle Te has a handy-dandy article that covers how to use the SMTAI 2022 Passport. Ambassador Exhibitors on the show floor will discuss their companies’ technology and stamp your passport, and the most active Explorers and most popular Ambassadors can win various prizes. Grab your pith helmet and start exploring.

Market and Tech Convergence: Electrically Conductive Inks 
Published October 17

In this article, Stan Farnsworth of NovaCentrix discusses the development of electrically conductive inks. Now in use in everything from smartphones and medical devices to cars and space suits, these inks can be configured by the OEM and applied in a variety of ways. Stan explains what all this means to designers and fabricators on the cutting edge.

Beyond Design: Routing Strategies to Minimize Radiation 
Published October 19

If you’re a designer or design engineer wrestling with EMI issues, this Barry Olney column is just for you. Barry explains how good routing practices can save up to 10 dB of substrate radiation. He addresses things like fanout, mark-to-space ratios, and flight time for microstrip vs. stripline. In case this topic isn’t your strongest suit, Barry summarizes your best way forward. Don’t miss it.

  

 

 

 

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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/28/2022 | Nolan Johnson, I-Connect007
Halloween is next Monday and parties will be taking place over the weekend, I’m sure. Here in the United States, at least, the “any-holiday-is-an-excuse-for-a-party” crowd has integrated Halloween, along with Valentine’s Day, St. Patrick’s Day, and Cinco de Mayo into wide-ranging opportunities for themed revelry. The news this week has been a bit crazy as well, though certainly not alcohol-fueled. There was a lot of important news and narrowing it down to just five was thought-provoking yet ultimately rewarding. Here then, are the five top pieces of news you shouldn’t miss this week.

PCB Technologies Sees Substrates as a Foundation

10/27/2022 | Nolan Johnson, I-Connect007
In this interview, PCB Technologies CEO Oved Shapira discusses the company's move into advanced packaging and heterogenous integration. Shapira explains how substrates and advanced packaging fit into the PCB fab and assembly ecosystem, and makes the argument that an all-inclusive fabrication and assembly supplier can be of great value to customers in product development and small scale production.

Lessons Learned: Breaking Down the Four Types of Communication

10/11/2022 | Nolan Johnson, PCB007 Magazine
Kelly Dack and Nolan Johnson explore the silver linings from the past two years, especially the importance of good communication. These skills are—as they have always been—key to the success of the project. But how do you define the best methods for communication? Kelly breaks down four personality types and why it’s important to recognize how one person differs from another. When you better understand how a person thinks, your level of effective communication increases exponentially.



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