Pillarhouse USA Announces New Service Manager

Reading time ( words)

Pillarhouse USA, Inc. is pleased to announce the appointment of David Leeper as Pillarhouse USA Service Manager, to spearhead and expand service offerings and customer machine support across the continental United States and Canada.

Jonathan Wol, President of Pillarhouse USA, Inc. stated “We are delighted to announce that David Leeper has joined the Pillarhouse USA service team, to strengthen the bond between sales and service and to lead our world-class customer service. His level of experience and knowledge makes for a fantastic addition to our management team.”

Mr. Leeper joins Pillarhouse with almost 20 years of experience in the electronics manufacturing industry. Initially, Mr. Leeper was a process engineer for an EMS company, managing their automated assemblies including SMT, wave, AOI and selective soldering. Following this, Mr. Leeper moved to a Tier 1 automotive supplier, responsible for DFM on new products, providing subject matter intel on PCB assemblies, as well as supplying engineering and manufacturing support at the company’s Mexico facility. Most recently, Mr. Leeper was Project Manager for Panasonic, building relationships with customers and coordinating installation and support for equipment and software.

Speaking upon his arrival, David stated, “I am very excited to join Pillarhouse USA and look forward to the new challenges this role will bring. My goal is to expand our service offerings, such as PillarCARE - our comprehensive after-sale and service program, available for all machines. We must maintain the superior level of support we provide, and are known for, as our North American market share continues to increase. This will include hiring regional field engineers, improving our self-help documentation, and streamlining our support line”.

Reflecting upon his prior Pillarhouse experiences, David said, “I encountered Pillarhouse at several of my previous customers, as well as at trade shows such as APEX and SMTA. Consensus was that Pillarhouse selective soldering equipment and customer service is unparalleled.”

David believes strengthening the relationship between sales and service is key to maintaining and growing Pillarhouse’s presence, explaining, “If we can boost our standing in regions where we are currently a little underrepresented, Pillarhouse will improve our strong level of support which separates us from our competition.”


Suggested Items

EPTAC Primed for SMTA International

10/19/2022 | Andy Shaughnessy, I-Connect007
I recently spoke with Leo Lambert, vice president of technology for EPTAC, about the training company’s newest classes and his plans for the upcoming SMTA International. The event, co-located with the Medical Device & Manufacturing (MD&M) Show, takes place in Minneapolis Oct. 31—Nov. 3. It’s never a dull moment in this industry and Leo takes a few minutes to talk about his company’s certification efforts, what’s planned for SMTAI, and where some of this technology is headed. Swallowing a pill that measures diagnostics? It’s a great time to be in the industry.

Solder Paste Printing and Optimizations for Interconnecting Back Contact Cells

07/26/2022 | Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.

Book Excerpt: 'The Printed Circuit Assembler’s Guide to… Solder Defects'

06/07/2022 | I-Connect007 Editorial Team
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.

Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.