Winners of IPC Hand Soldering & Rework Competition at NEPCON Nagoya 2022 Announced


Reading time ( words)

IPC hosted its popular IPC Hand Soldering and Rework Competition in Nagoya, Japan on October 26-28, 2022. Held for the first time in person since the COVID-19 pandemic, the competition welcomed 24 finalists from 17 electronics companies from Japan. The total number of the competitors exceeded 130; 24 finalists passed the primary and the secondary qualifiers and competed at the final stage.

Skilled contestants competed against each other to rework a functional electronics assembly within a 45-minute time limit. Assemblies were judged on soldering in accordance with IPC-A-610H, IPC J-STD-001H, IPC-7711/21C - Class 3 criteria, the speed at which the assembly was produced, and overall electrical functionality of the assembly.

On the winner’s podium at NEPCON Nagoya 2022 were:

First place: Masaki Nakamichi, Panasonic Corporation. He received a certificate, a cash prize of USD$500 and a soldering station from premier sponsor -- JBC Soldering Japan.  As the winner, Nakamichi qualified for the IPC Hand Soldering World Championship at electronica in Munich, Germany, November 15–18, 2022.                                                                                     

Second place: Yuki Miyashita, FUJIFILM Healthcare Manufacturing Corporation. He received a certificate and a cash prize of USD$300.

Third place: Nao Morita, Advantest Corporation. She received a certificate and a cash prize of USD$100.

IPC would like to thank Hand Soldering and Rework Competition sponsors and partners for their generous support this year:

  • Premier Sponsors — JAPAN UNIX, JBC Japan
  • Supporting Sponsors — NIHON SUPERIOR, SMIC

For more information on upcoming hand soldering and rework competitions in Asia, contact Yusaku Kono, IPC Japan representative, at YusakuKono@ipc.org.

Share




Suggested Items

Advanced Packaging Symposium: Looking in the Rearview Mirror

11/23/2022 | Nolan Johnson, I-Connect007
Matt Kelly had the vision and Jan Vardaman set the tone for the IPC Advanced Packaging Symposium, Oct. 11-13 in Washington, D.C. So, did they accomplish their goals? What were the real takeaways from the event, and what can we expect to see next? Spoiler alert: Matt and Jan came away impressed in more ways than one.

Working on the Hill to Build a Future

11/08/2022 | Nolan Johnson, I-Connect007
The message can’t be emphasized enough: Producing IC substrates overseas weakens America’s position and national security. In this frank discussion with Will Marsh, president of PCBAA, he talks about his efforts to educate government policymakers on the dire need to consider the entire microelectronics ecosystem. There’s power in numbers, Will says, and he sees the association’s efforts making a difference.

EPTAC Primed for SMTA International

10/19/2022 | Andy Shaughnessy, I-Connect007
I recently spoke with Leo Lambert, vice president of technology for EPTAC, about the training company’s newest classes and his plans for the upcoming SMTA International. The event, co-located with the Medical Device & Manufacturing (MD&M) Show, takes place in Minneapolis Oct. 31—Nov. 3. It’s never a dull moment in this industry and Leo takes a few minutes to talk about his company’s certification efforts, what’s planned for SMTAI, and where some of this technology is headed. Swallowing a pill that measures diagnostics? It’s a great time to be in the industry.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.