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iNEMI’s AI Enhancement to AOI for PCBA project recently conducted an industry survey to assess the development of artificial intelligence (AI) and its implementation for automated optical inspection (AOI) in board assembly. The survey was designed to capture the state of technology adoption, determine the most common defect modes and component types evaluated by AOI, and identify key challenges along with lessons learned for future development.
Survey responses indicate that adoption of AI for AOI in the PCB assembly process is still at an early stage, and there are obvious knowledge and resource gaps to be addressed. For example, not many trained AI models are available to cover various component types and defect modes and, on the personnel side, data scientists are needed to effectively add AI to board assembly processes.
Practical evaluation and industrial references are needed for AOI users to gain confidence and become better prepared for investing in AI technology and integrating it into their manufacturing processes. Based on the input from this survey, the iNEMI project will continue with experimental work to further explore the potential benefits and opportunities that AI could bring for AOI in board assembly — such as detection of true failures — with greater accuracy and in less time, and with a reduction in man-hours, re-inspection and repeated machine program optimization processes.
Michelle Te, I-Connect007
It’s officially fall, and that means it's time to start planning your trade show attendance. To help you make decisions about when and where to go, we’ve put together a list of industry trade shows. It has been two long years with no or few in-person trade shows, and we’ve felt it. So, now we’re back in business and ready to hit the road. Do you have a show or conference to add to our list? Let us know!
I-Connect007 Editorial Team
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.
Mark Laing, Siemens Digital Industries Software
New product introductions (NPIs) and customization have been increasing rapidly over the past few years—with the results that the already-small profit margins in electronics assembly are shrinking even further. Fifteen years ago, the PCB was the product. Today, most products are a system, with multiple PCBs, cables, and enclosures. Many manufacturers want to provide turn-key products that have multiple BOMs, making the assembly process even more complicated.